Apr 4, 2017

Starting Framework of the IRDS Roadmap

IEEE has announced the next milestone phase in the development of the International Roadmap for Devices and Systems (IRDS), an IEEE Standards Association (IEEE-SA) Industry Connections (IC) Program sponsored by the IEEE Rebooting Computing (IEEE RC) Initiative with the launch of a series of nine white papers that reinforce the initiative’s core mission and vision for the future of the computing industry. The white papers also identify industry challenges and solutions that guide and support future roadmaps created by IRDS [read more...]

The series of white papers delivers the starting framework of the IRDS roadmap - and through the sponsorship of IEEE RC—will inform the various roadmap teams in the broader task of mapping the devices’ and systems’ ecosystem:
The IRDS leadership team hosted a winter workshop and kick-off meeting at the Georgia Institute of Technology on 1-2 December 2016. Key discoveries from the workshop included the international focus teams’ plans and focus topics for the 2017 roadmap, top-level needs and challenges, and linkages among the teams. Additionally, the IRDS leadership invited presentations from the European and Japanese roadmap initiatives. This resulted in the 2017 IRDS global membership expanding to include team members from the “NanoElectronics Roadmap for Europe: Identification and Dissemination” (NEREID) sponsored by the European Semiconductor Industry Association (ESIA), and the “Systems and Design Roadmap of Japan” (SDRJ) sponsored by the Japan Society of Applied Physics (JSAP).

The IRDS team and its supporters will convene 1-3 April 2017 in Monterey, California, for the Spring IRDS Workshop, which is part of the 2017 IEEE International Reliability Physics Symposium (IRPS). The team will meet again for the Fall IRDS Conference in partnership with the 2017 IEEE International Conference on Rebooting Computing (ICRC) scheduled for 6-7 November 2017 in Washington, D.C. More information on both events can be found here.

IEEE RC is a program of IEEE Future Directions, designed to develop and share educational tools, events, and content for emerging technologies [read more...]

Mar 24, 2017

NIST Digital Library of Mathematical Functions


[paper] Pulsed I-V on TFETs: Modeling and Measurements

Pulsed I-V on TFETs: Modeling and Measurements
Quentin Smets, Anne Verhulst, Ji-Hong Kim, Jason P. Campbell, David Nminibapiel, Dmitry Veksler, Pragya Shrestha, Rahul Pandey, Eddy Simoen, David Gundlach, Curt Richter, Kin P. Cheung, Suman Datta, Anda Mocuta, Nadine Collaert, Aaron V.-Y. Thean, and Marc M. Heyns
in IEEE Transactions on Electron Devices, vol. 64, no. 4, pp. 1489-1497, April 2017
doi: 10.1109/TED.2017.2670660

Abstract: Most experimental reports of tunneling field-effect transistors show defect-related performance degradation. Charging of oxide traps causes Fermi-level pinning, and Shockley–Read–Hall (SRH)/trap-assisted tunneling (TAT) cause unwanted leakage current. In this paper, we study these degradation mechanisms using the pulsed I-V technique. Our simulations show pulsed I-V can fully suppress oxide trap charging, unlike SRH and TAT. We discuss several circuit-related pitfalls, and we demonstrate improved transfer characteristics by suppressing oxide trap charging using cryogenic pulsed I-V [read more...]


Mar 16, 2017

[mos-ak] [paper submission] Device and Circuit Compact Modeling TRACK4 at ESSDERC

Dear Compact Modeling Experts,
I would like to draw your attention to newly opened Device and Circuit Compact Modeling TRACK4 at ESSDERC. I was assigned to chair the track 4 with a group of the international reviewers. The new tract will cover a broad range of the compact modeling and its Verilog-A standardization topics (see below). I hope you will find these topic matching your current scientific work and R&D activities and you will eventually submit your conference paper for our new Device and Circuit Compact Modeling TRACK4 at ESSDERC.

Papers must not exceed four A4 pages with all illustrations and references included. All submissions must be received by 10 April, 2017. After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by June 2, 2017. At the same time, the complete program will be published on the ESSDERC/ESSCIRC website.

I will be glad if you could also proactively promote our Device and Circuit Compact Modeling TRACK4 and also motivate and invite other compact modeling researchers and engineers to also submit their R&D scientific conference contributions. Please distribute my open invitation to all experts in your region.

Already now, I am looking forward to receive your conference submission and then meeting you at ESSDERC in Leuven.

-- thanks in advance -- wladek;
--
ESSDERC TRACK4: Device and Circuit Compact Modeling
TPC <http://www.esscirc-essderc2017.org/essderc-technical-program-committee>
Topics:<http://www.esscirc-essderc2017.org/essderc-call-for-papers>
Compact/SPICE modeling of electronic, optical, organic, and hybrid devices and their IC implementation and interconnection. Topics include compact/SPICE models and its Verilog-A standardization of the semiconductor devices (including Bio/Med sensors, MEMS, Microwave, RF, High voltage and Power), parameter extraction, compact models for emerging technologies and novel devices, performance evaluation, reliability, variability, and open source benchmarking/implementation methodologies. Modeling of interactions between process, device, and circuit design as well as Foundry/Fabless Interface Strategies.
---
WG160317

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Qucs Roadmap

The QUCS Roadmap should serve as base to track the status of each action point. Enhancements can be handled in two ways:
  • For simpler enhancements an issue/bug ticket shall be created and referenced back here. The pertinent discussion and documentation should be done on the body of each ticket.
  • For more complex enhancements a Qucs Enhancement Proposal should be created and reference back here.
The open action points can be further categorized concerning the difficulty or amount of work as (Easy, Medium, Hard) and priority (0-3, 0 is the highest). See the Port to Qt4 / Qt5 for an example. Tickets will be tracked individually and assigned to milestones leading to stable releases.


Read more about QUCS Roadmap

Mar 7, 2017

Bio-SPICE

Bio-SPICE: Biological Simulation Program for Intra- and Inter-Cellular Evaluation
 
Bio-SPICE, an open source framework and software toolset for Systems Biology, is intended to assist biological researchers in the modeling and simulation of spatio-temporal processes in living cells. In addition, our goal is to develop and serve a user community committed to using, extending, and exploiting these tools to further our knowledge of biological processes.

In collaboration with other Bio-SPICE, Community members, we will develop, license, distribute, and maintain a comprehensive software environment that integrates a suite of analytical, simulation, and visualization tools and services to aid biological researchers engaged in building computable descriptions of cellular functions. From disparate data analysis and information mining to experimental validation of computational models of cell systems, our environment will offer a comprehensive substrate for efficient research, collaboration, and publication.

Mission
Bio-SPICE, is intended for modeling and simulation of spatio-temporal processes in living cells. The goals of Bio-SPICE, are to support discovery through:
  1. Developing computational and mathematical models of bio-molecular systems in cells capturing the nature of gene-protein interactions
  2. Developing tools that can rapidly incorporate relevant experimental data and knowledge known in the literature to build models of pathways, networks, and spatial processes
  3. Developing simulation tools for the dynamic analysis of bio-molecular systems
  4. Creating an extensible framework for easy insertion of models and their refinement, as well as customization to specific mechanisms
In addition, our goal is to develop and serve a user community committed to using, extending, and exploiting these tools to further our knowledge of biological processes. In collaboration with other Bio-SPICE Community members, we will develop, license, distribute, and maintain a comprehensive software environment that integrates a suite of analytical, simulation, and visualization tools and services to aid biological researchers engaged in building computable descriptions of cellular functions. From disparate data analysis and information mining to experimental validation of computational models of cell systems, our environment will offer a comprehensive substrate for efficient research, collaboration, and publication [read more...]

[paper] III-V Channel Double Gate FETs

Compact Modeling of Charge, Capacitance, and Drain Current
in III-V Channel Double Gate FETs
C. Yadav; M. Agrawal; A. Agarwal; Y. S. Chauhan
in IEEE Transactions on Nanotechnology , vol.PP, no.99, pp.1-1
doi: 10.1109/TNANO.2017.2669092
Abstract: In this paper, we present a surface potential based compact modeling of terminal charge, terminal capacitance, and drain current for III-V channel double gate field effect transistor (DGFET) including the effect of conduction band nonparabolicity. The proposed model is developed accounting for the 2-D density of states and includes the effect of quantum capacitance associated with the low density of states channel material. In addition, model incorporates contribution of the first two subbands and efficiently captures the step like behavior appearing in the gate capacitance and trans-conductance with population of the higher sub-bands. The behavior of bias dependent terminal capacitances and drain current are verified with the numerical simulation data of InGaAs channel DGFET and shows a close agreement with the simulation data [read more...]