Nov 11, 2013

[Call for Papers] IWCM 2014

Call for Papers IWCM 2014 
11th International Workshop on Compact Modeling 
January 23 (Thursday), 2014 
Suntec Singapore Convention and Exhibition Centre (Room 309)  
Scope: 
The workshop provides an opportunity for the discussion and the presentation of advances in modeling and simulation of integrated circuits.

Topics: 
  • Compact modeling for all kinds of devices 
  • Parameter extraction methodology and strategy 
  • Circuit simulation techniques and platforms 

Abstract Submission:
Authors should submit a camera-ready abstract with 2 to 10 pages including figures for inclusion in the Workshop Proceedings, and send the electronic file in PDF or MS-Word format to mchan@ust.hk. Paper templates in Word format is downloadable from the ASP-DAC 2014 site. Deadline for the submission is December 15th, 2013. 
  • Organization:
    Chair: Mansun Chan (Hong Kong University of Science and Technology, Hong Kong)
    Co-Chair: Hans Juergen Mattausch (Hiroshima University, Japan) 
  • Committee members:
    T. Aikyou (STARC, Japan)
    Y. Cao (Arizona State University, USA)
    Jamel Deen (McMaster University, Canada)
    J. He (Peking University, China)
    Y. J. Park (Seoul National University, Korea)
    Zhiping Yu, (Tsinghua University, China)
    Xing Zhou (Nanyang Technology University, Singapore) 
Sponsor:
The University Grant Council of Hong Kong through the Area of Excellence Project (AOE/P-04/08)

Fee: Free admission

Contact: 
If you have any question, please contact  Mansun Chan

Nov 9, 2013

LETI Devices Workshop

The Churchill Hotel - 1914 Connecticut Ave. NW (across from the Hilton)
Washington D.C. 6-9 p.m on December 8, 2013

Inventing the future together: a stimulating discussion of our vision for silicon nanotechnologies in the next 10 years followed by a networking cocktail. Program is as follow:
  • Introduction (10min)
    Jean-René Lequepeys; VP Silicon Components Division 
  • Lithography cost-effective solutions for 1X nodes (15min)
    Serge Tedesco; Lithography Program Manager 
  • 3D: Dream and reality (15 min)
    Mark Scannell; Senior Business Development Manager 
  • High-performance and reliable resistive memories embedded in advanced logic CMOS technologies (15min)
    Barbara de Salvo; Advanced Memories Fellow
  • M&NEMS platforms: an enabler for the next generation of sensors in consumer electronics (15min)
    Hugues Metras; VP Strategic Partnerships, North America
  • CMOS technologies: our most power efficient solution today and our vision toward 10nm node and beyond (15 min)
    Maud Vinet; Advanced CMOS Manager
[read more...]

Oct 25, 2013

MIEL2014 Abstracts Deadline Extension

IEEE 29th International Conference on Microelectronics (MIEL 2014) is to be held on 11-14 May 2014 at the Serbian Academy of Science and Arts, Belgrade, Serbia. The extended submission deadline for 2-page extended abstracts of regular contributions had been set to 26th, but, due to many requests by authors, we will continue receiving the submissions by October 31st 2013.

More detailed information on MIEL 2014 can be found in the attached Call for Papers, as well as on the conference web site http://miel.elfak.ni.ac.rs/. We will be looking forward to receiving your submission and seeing you at our conference next year in May.

[read more...]

Oct 22, 2013

SISPAD Abstract Submission

2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9 – 11, 2014
Workshop, September 8
Mielparque Yokohama, Yokohama, Japan

Deadline for submission of SISPAD abstract: March 1, 2014

Any inquiries on submission should be sent to:
  • Program Chair:  Ken’ichiro Sonoda (Renesas)
  • Program Co-Chair:  Shigeyasu Uno (Ritsumeikan Univ)

Oct 15, 2013

[mos-ak] note in the IEEE EDS REGIONAL AND CHAPTER NEWS

REGIONAL AND CHAPTER NEWS
ED Germany – by Joachim N. Burghartz 

The German Chapter of IEEE EDS sponsored the annual spring compact modeling workshop of the MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, held April 11– 12, 2013. The meeting was supported by Prof. Doris Schmid-Landsiedel and the staff of the Institute for Technical Electronics, TUM, Munich, who is one of the local coordinators of the ED German Chapter. More than 30 international academic researchers and modeling engineers attended three sessions to listen to 12 technical compact modeling presentations. As in previous years this well-established effort has been coordinated by Wladek Grabinski, Switzerland. The workshop's three sessions focused on common compact modeling actions. Sessions included: (i) How to consolidate and build consistent simulation hierarchy at all levels of advanced TCAD numerical modeling; (ii) Compact/ SPICE modeling for Analog / Mixed Signal circuits; and (iii) Corner modeling and statistical simulations. The MOS-AK/GSA speakers were K.-W. Pieper (Infineon), M. Sylvester (MunEDA), B. Iñiguez (URV), I. Nickeleit (Agilent), L. Heiss (LTE, TUM); T. Schulz (Intel), C. Jungemann (RWTH), M. Brinson (London Metropolitan University), B.-Y. Nguyen (SOITEC), A. Kloes (THM), U. Monga (Intel), and M. Bucher (TUC). The event was accompanied by a series of the software/hardware demos by MOS-AK/GSA industrial partners: Agilent, MunEDA and Tanner EDA. The session technical and software/ hardware demo presentations are available for download at: <http:// www.mos-ak.org/munich_2013/>. 

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Oct 2, 2013

OBip: Open Bipolar Workshop at BCTM in Bordeaux

Open Workshop on European Bipolar related projects: 
Abstract: In Europe, a huge effort is actually undertaken to strengthen Europe's leading edge position in SiGe HBT technology and modeling as well as SiGe enabled mm-wave applications thanks to two European projects that are: DOTSEVEN which aims to achieve HBTs with cut-off frequencies (fmax) of around 700 GHz and RF2THz which aims at the establishment of a 300mm BiCMOS Silicon technology platform for emerging RF, mm-wave and THz consumer applications, as well as Si photonics integration. During this common workshop the main achievements of these projects will be presented.

Opening and Welcome (8:15 AM), Thomas Zimmer, University  Bordeaux 1

Session 1: Technology (8:30 - 10:30 AM)
Alexander Fox, IHP (8:30 - 9:10 AM)
   SiGe HBT Technology Development in the DOTSEVEN  Project
Pascal Chevalier, ST Microelectronics (9:10 - 9:50 AM)
   A 55-nm BiCMOS Platform for Optical and Millimeter-Wave  Systems-on-Chip
Dieter Knoll, IHP (9:50 – 10:30 AM)
   BiCMOS integration of photonic components
Coffee break
Session 2: Modelling and Characterization (11:00 AM – 1:00 PM)
Andreas Pawlak, Univ. of Dresden (11:00 – 11:40 AM)
   Latest developments of HICUM/L2 for mm-wave applications
Bertrand Ardouin, XMOD Technologies (11:40 – 12:20 AM)
   Tools and environment for Sub-THz circuit design
Sebastien Fregonese, CNRS (12:20 AM – 1:00 PM)
   Electro-Thermal Device Characterization & Modelling
Lunch break
Session 3: Design and demonstrator (2:00 – 4:00 PM)
Marco Spirito, University of Delft (2:00 – 2:40 PM)
   Building blocks and system architecture for mm-wave imaging radar
Olivier Tesson, NXP (2:40 – 3:20 PM)
   Passive integration and Packaging for mm-wave applications
Wolfgang Templ, Alcatel Lucent (3:20 – 4:00 PM)
   Application Scenarios from RF2THz

4:00: End of the Open Bipolar Workshop OBip

[read more: 3rd Day Workshop: Special European Dot 5/Dot 7 Workshop]

Sep 30, 2013

[mos-ak] Call for Papers] 6th International MOS-AK/GSA Workshop Dec. 11, 2013 Washington DC

Together with the Organizing Committee and Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the 6th International MOS-AK/GSA Workshop Dec. 11, 2013 Washington DC. The specific workshop goal will be to classify the most important directions for the future development of the electron device models, not limiting the discussion to compact models, but including physical, analytical and numerical models, to clearly identify areas that need further research and possible contact points between the different modeling domains (Technology TCAD, SPICE/Verilog-A standardization, advanced IC designs) . A freewheeling session will be also organized to review modeling activities of the CMC, NEEDS NanoHub and MOS-AK Groups.

Topics to be covered include the following:
  • Advances in semiconductor technologies and processing
  • Compact Modeling (CM) of the electron devices
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • CM of passive, active, sensors and actuators
  • Emerging Devices, CMOS and SOI-based memory cells
  • Microwave, RF device modeling, high voltage device modeling
  • Nanoscale CMOS devices and circuits
  • Technology R&D, DFY, DFT and IC Designs
  • Foundry/Fabless Interface Strategies
Speakers provisionary list (in alphabetic order)
  • Keith Green, TI, CMC Chair (US)
  • Benjamin Iniguez, URV (SP)
  • Eric Keiter, Xyce Team, Sandia (US) 
  • Luca Larcher, Uni. Modena (I)
  • Mark Lundstrom, NEEDS, NanoHub (US)
  • Michael Shur, RPI (US)
  • Sadayuki Yoshitomi, Toshiba (J)
In the terms of participation, intending participants and authors should also note the following dates: 
  • Call for Papers - Sept. 2013
  • 2nd Announcement - Oct 2013
  • Final Workshop Program - Nov. 2013
  • MOS-AK/GSA Workshop - Dec. 11, 2013

Further details and updates: <http://www.mos-ak.org/washington_dc_2013/
Email contact: <workshops@mos-ak.org

- with regards - WG (for the MOS-AK/GSA Committee
===
Arbeitskreis Modellierung von Systemen und Parameterextraktion 
Modeling of Systems and Parameter Extraction Working Group 
http://mos-ak.org/
===

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