Sep 23, 2011

[Internship] Modeling of GaN Power Transistors for IC Design

Internship framework: At the heart of the MINATEC innovation campus, Leti institute is one of the most important R&D laboratories in Europe in the field of microelectronics and nanotechnologies. Within the Alternative Energies and Atomic Energy Commission, CEA-Leti is developing GaN-based technologies and power devices for energy conversion in different industrial fields (energy management, automotive electronics, electric car). In order to design and simulate integrated circuits, it is mandatory to develop electro-thermal models of power transistors.  
Work description: The aim of the internship is to develop a specific model for GaN-based high electron mobility transistors (HEMTs). This wide bandgap semiconductor is one of the most promising for power electronics and is currently the subject of extensive research. This internship will take place in the Simulation and Modeling laboratory (LSM) of the Silicon Components Division (DCOS).  
This internship is divided into four parts:
  1. Understanding of physical phenomena (electrical, thermal) in power HEMT transistors and analysis of existing models
  2. TCAD numerical simulations of devices. 
  3. Compact modeling of transistors starting from previous studies on silicon carbide (SiC) transistors. 
  4. Depending on availability, static and pulsed measurements on GaN transistors and extraction of model parameters.  
Host Institution
Direction/Département/Service/Laboratoire CEA-LETI – DRT/DCOS/SCME/LSM
Postal address
CEA/GRENOBLE, MINATEC Campus,
17 rue des Martyrs 38054 Grenoble CEDEX 9
France  

Technical Supervisor 
Patrick MARTIN
Phone: 04 38 78 67 05

Sep 20, 2011

Digging into Technology's Past

This detailed line drawing of the MOS Technology 6502 microprocessor is a physical description of all the connections between the various circuits on the chip. (Courtesy Greg James, Visual 6502, more in archaeology by Nikhil Swaminathan)

Sep 13, 2011

FAST-SPICE BETA TESTERS WANTED

All participants in the beta-testing program will receive the Symica Fast-SPICE product SymSpice Turbo as a free addition to the Symica tool suite. If you'd like to be a beta tester for the SymSpice Turbo, please send a request to support@symica.com. [more at: http://www.symica.com/news/fast-spice-beta-testers-wanted]

Sep 2, 2011

“The Ugly Duckling,” New Fairy Tales

"The developments of UF process-based “compact” MOSFET models have been reviewed, and exemplary new physical insights on SOI devices attained with the models have been overviewed. Indeed, the UF models have been, and are effective research/education tools. The “ugly duckling” has prevailed, just like in the fairy tale (illustrated in Fig. 10) [19]!" J. G. Fossum

[19] H. C. Anderson, “The Ugly Duckling,” New Fairy Tales. C. A. Reitzel, Copenhagen, Denmark, Nov. 1843.
in
J. Fossum, “UF ‘ Compact ’ Models : A Historical Perspective,” Nanotech, vol. 2, pp. 714 - 719, 2011.

Aug 31, 2011

Operation and Modeling of the MOS Transistor

Yannis Tsividis and Colin McAndrew


New to this edition:

  • Energy bands and the energy barrier viewpoint are integrated into the discussion in a smooth, simple manner
  • Expanded discussion of small-dimension effects, including velocity saturation, drain-induced barrier lowering, ballistic operation, polysilicon depletion, quantum effects, gate tunneling current, and gate-induced drain leakage
  • Expanded discussion of small-signal modeling, including gate and substrate current modeling and flicker noise
  • New chapter on substrate nonuniformity and structural effects, discussing transversal and lateral (halo) doping nonuniformity, stress and well proximity effects, and statistical variability
  • A completely re-written chapter on modeling for circuit simulation, covering the considerations and pitfalls in the development of models for computer-aided design
  • Extensively updated bibliography
  • An accompanying website includes additional details not covered in the text, as well as model computer code
ISBN-10: 0195170156 | ISBN-13: 978-0195170153 | Edition: 3