Wednesday, 4 December 2013

[mos-ak] SPICE Development Roadmap

The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, delivered its annual autumn compact modeling workshop on Sept. 20, 2013 as an integral part of the ESSDERC/ESSCIRC Conference in Bucharest (RO). The event received full sponsorship from leading industrial partners including Agilent Technologies, LFoundry and Microchip. More than 30 international academic researchers and modeling engineers attended two sessions to hear 12 technical compact modeling presentations and posters including the keynote by Larry Nagel.

The MOS-AK keynote speaker, Larry Nagel, delivered "SPICE in the Twenty-First Century" talk drawing a roadmap of future SPICE development directions. So how will SPICE evolve in the future?  [read more]

In the meantime please also visit <http://www.mos-ak.org/washington_dc_2013/> where we will continue the discussion of all compact/SPICE modeling topics.

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SISPAD 2014 1st Call for Papers


2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9-11, 2014
Workshop, September 8
Mielparque Yokohama, Yokohama, Japan


The call for papers is also available on SISPAD2014 Web site. Deadline for submission of SISPAD abstracts: March 31, 2014


Any inquiries on submission should be sent to:
  • Steering Chair:  Shinji Odanaka  (Osaka Univ)
  • Conference Chair:  Nobuya Mori  (Osaka Univ)
  • Program Chair:  Kenichiro Sonoda  (Renesas)
  • Program Co-Chair:  Shigeyasu Uno  (Ritsumeikan Univ)

Wednesday, 20 November 2013

[mos-ak] [Final Program] 6th International MOS-AK/GSA Workshop Washington DC Dec.11, 2013

Final program of 6th International MOS-AK/GSA Workshop on Dec.11, 2013 in Washington DC is available online:
The program includes a freewheeling session organized to review modeling activities of the CMC, IEEE EDS CMTC, NEEDS NanoHub and MOS-AK Groups.

Event venue:
Embassy of Switzerland
2900 Cathedral Ave, NW,  
Washington, DC 20008 
USA 

Free On-line Workshop Registration is open, now.

Extended MOS-AK/GSA Committee:
  • Wladek Grabinski, GMC Suisse; MOS-AK/GSA Group Manager
  • Harrison Beasley, Technical WG Manager, GSA
    MOS-AK/GSA North America
  • Chair: Pekka Ojala, Exar Corporation
  • Co-Chair: Geoffrey Coram, Analog Devices
  • Co-Chair: Prof. Jamal Deen, U.McMaster
  • Co-Chair: Roberto Tinti, Agilent EEsof Division
    MOS-AK/GSA South America
  • Chair: Prof. Gilson I Wirth; UFRGS; Brazil
  • Co-Chair: Prof. Carlos Galup-Montor, UFSC; Brazil
  • Co-Chair: Sergio Bampi, UFRGS, Brazil
  • Co-Chair: Antonio Cerdeira Altuzarra, Cinvestav - IPN, Mexico
    MOS-AK/GSA Europe
  • Chair: Ehrenfried Seebacher, AMS, Austria
  • Co-Chair: Alexander Petr, XFab, Germany
  • Co-Chair: Prof. Benjamin Iniguez, URV, Spain
    MOS-AK/GSA Asia/South Pacific
  • Chair: Sadayuki Yoshitomi, Toshiba 
  • Co-Chair: Xing Zhou, NTU Singapore    
  • Co-Chair: A.B. Bhattacharyya, JIIT New Delhi
 

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Wednesday, 13 November 2013


2014 Workshop on Compact Modeling at techconnectworld.com



Abstracts due: December 13th, 2013

Synopsis: Compact Models (CMs) for circuit simulation have been at the heart of CAD tools for circuit design over the past decades, and are playing an ever increasingly important role in the nanometer system-on-chip (SOC) era. As the mainstream MOS technology is scaled into the nanometer regime, development of a truly physical and predictive compact model for circuit simulation that covers geometry, bias, temperature, DC, AC, RF, and noise characteristics becomes a major challenge.

Workshop on Compact Modeling (WCM) Is one of the first of its kind in bringing people in the CM field together. The objective of WCM is to create a truly open forum for discussion among experts in the field as well as feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development and deployment, within the main theme - compact models for circuit simulation.

Symposium Chair: Professor Xing Zhou Nanyang Technological University, Singapore

Monday, 11 November 2013

[Call for Papers] IWCM 2014

Call for Papers IWCM 2014 
11th International Workshop on Compact Modeling 
January 23 (Thursday), 2014 
Suntec Singapore Convention and Exhibition Centre (Room 309)  
Scope: 
The workshop provides an opportunity for the discussion and the presentation of advances in modeling and simulation of integrated circuits.

Topics: 
  • Compact modeling for all kinds of devices 
  • Parameter extraction methodology and strategy 
  • Circuit simulation techniques and platforms 

Abstract Submission:
Authors should submit a camera-ready abstract with 2 to 10 pages including figures for inclusion in the Workshop Proceedings, and send the electronic file in PDF or MS-Word format to mchan@ust.hk. Paper templates in Word format is downloadable from the ASP-DAC 2014 site. Deadline for the submission is December 15th, 2013. 
  • Organization:
    Chair: Mansun Chan (Hong Kong University of Science and Technology, Hong Kong)
    Co-Chair: Hans Juergen Mattausch (Hiroshima University, Japan) 
  • Committee members:
    T. Aikyou (STARC, Japan)
    Y. Cao (Arizona State University, USA)
    Jamel Deen (McMaster University, Canada)
    J. He (Peking University, China)
    Y. J. Park (Seoul National University, Korea)
    Zhiping Yu, (Tsinghua University, China)
    Xing Zhou (Nanyang Technology University, Singapore) 
Sponsor:
The University Grant Council of Hong Kong through the Area of Excellence Project (AOE/P-04/08)

Fee: Free admission

Contact: 
If you have any question, please contact  Mansun Chan

Saturday, 9 November 2013

LETI Devices Workshop

The Churchill Hotel - 1914 Connecticut Ave. NW (across from the Hilton)
Washington D.C. 6-9 p.m on December 8, 2013

Inventing the future together: a stimulating discussion of our vision for silicon nanotechnologies in the next 10 years followed by a networking cocktail. Program is as follow:
  • Introduction (10min)
    Jean-René Lequepeys; VP Silicon Components Division 
  • Lithography cost-effective solutions for 1X nodes (15min)
    Serge Tedesco; Lithography Program Manager 
  • 3D: Dream and reality (15 min)
    Mark Scannell; Senior Business Development Manager 
  • High-performance and reliable resistive memories embedded in advanced logic CMOS technologies (15min)
    Barbara de Salvo; Advanced Memories Fellow
  • M&NEMS platforms: an enabler for the next generation of sensors in consumer electronics (15min)
    Hugues Metras; VP Strategic Partnerships, North America
  • CMOS technologies: our most power efficient solution today and our vision toward 10nm node and beyond (15 min)
    Maud Vinet; Advanced CMOS Manager
[read more...]

Friday, 25 October 2013

MIEL2014 Abstracts Deadline Extension

IEEE 29th International Conference on Microelectronics (MIEL 2014) is to be held on 11-14 May 2014 at the Serbian Academy of Science and Arts, Belgrade, Serbia. The extended submission deadline for 2-page extended abstracts of regular contributions had been set to 26th, but, due to many requests by authors, we will continue receiving the submissions by October 31st 2013.

More detailed information on MIEL 2014 can be found in the attached Call for Papers, as well as on the conference web site http://miel.elfak.ni.ac.rs/. We will be looking forward to receiving your submission and seeing you at our conference next year in May.

[read more...]

Tuesday, 22 October 2013

SISPAD Abstract Submission

2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9 – 11, 2014
Workshop, September 8
Mielparque Yokohama, Yokohama, Japan

Deadline for submission of SISPAD abstract: March 1, 2014

Any inquiries on submission should be sent to:
  • Program Chair:  Ken’ichiro Sonoda (Renesas)
  • Program Co-Chair:  Shigeyasu Uno (Ritsumeikan Univ)

Tuesday, 15 October 2013

[mos-ak] note in the IEEE EDS REGIONAL AND CHAPTER NEWS

REGIONAL AND CHAPTER NEWS
ED Germany – by Joachim N. Burghartz 

The German Chapter of IEEE EDS sponsored the annual spring compact modeling workshop of the MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, held April 11– 12, 2013. The meeting was supported by Prof. Doris Schmid-Landsiedel and the staff of the Institute for Technical Electronics, TUM, Munich, who is one of the local coordinators of the ED German Chapter. More than 30 international academic researchers and modeling engineers attended three sessions to listen to 12 technical compact modeling presentations. As in previous years this well-established effort has been coordinated by Wladek Grabinski, Switzerland. The workshop's three sessions focused on common compact modeling actions. Sessions included: (i) How to consolidate and build consistent simulation hierarchy at all levels of advanced TCAD numerical modeling; (ii) Compact/ SPICE modeling for Analog / Mixed Signal circuits; and (iii) Corner modeling and statistical simulations. The MOS-AK/GSA speakers were K.-W. Pieper (Infineon), M. Sylvester (MunEDA), B. Iñiguez (URV), I. Nickeleit (Agilent), L. Heiss (LTE, TUM); T. Schulz (Intel), C. Jungemann (RWTH), M. Brinson (London Metropolitan University), B.-Y. Nguyen (SOITEC), A. Kloes (THM), U. Monga (Intel), and M. Bucher (TUC). The event was accompanied by a series of the software/hardware demos by MOS-AK/GSA industrial partners: Agilent, MunEDA and Tanner EDA. The session technical and software/ hardware demo presentations are available for download at: <http:// www.mos-ak.org/munich_2013/>. 

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Wednesday, 2 October 2013

OBip: Open Bipolar Workshop at BCTM in Bordeaux

Open Workshop on European Bipolar related projects: 
Abstract: In Europe, a huge effort is actually undertaken to strengthen Europe's leading edge position in SiGe HBT technology and modeling as well as SiGe enabled mm-wave applications thanks to two European projects that are: DOTSEVEN which aims to achieve HBTs with cut-off frequencies (fmax) of around 700 GHz and RF2THz which aims at the establishment of a 300mm BiCMOS Silicon technology platform for emerging RF, mm-wave and THz consumer applications, as well as Si photonics integration. During this common workshop the main achievements of these projects will be presented.

Opening and Welcome (8:15 AM), Thomas Zimmer, University  Bordeaux 1

Session 1: Technology (8:30 - 10:30 AM)
Alexander Fox, IHP (8:30 - 9:10 AM)
   SiGe HBT Technology Development in the DOTSEVEN  Project
Pascal Chevalier, ST Microelectronics (9:10 - 9:50 AM)
   A 55-nm BiCMOS Platform for Optical and Millimeter-Wave  Systems-on-Chip
Dieter Knoll, IHP (9:50 – 10:30 AM)
   BiCMOS integration of photonic components
Coffee break
Session 2: Modelling and Characterization (11:00 AM – 1:00 PM)
Andreas Pawlak, Univ. of Dresden (11:00 – 11:40 AM)
   Latest developments of HICUM/L2 for mm-wave applications
Bertrand Ardouin, XMOD Technologies (11:40 – 12:20 AM)
   Tools and environment for Sub-THz circuit design
Sebastien Fregonese, CNRS (12:20 AM – 1:00 PM)
   Electro-Thermal Device Characterization & Modelling
Lunch break
Session 3: Design and demonstrator (2:00 – 4:00 PM)
Marco Spirito, University of Delft (2:00 – 2:40 PM)
   Building blocks and system architecture for mm-wave imaging radar
Olivier Tesson, NXP (2:40 – 3:20 PM)
   Passive integration and Packaging for mm-wave applications
Wolfgang Templ, Alcatel Lucent (3:20 – 4:00 PM)
   Application Scenarios from RF2THz

4:00: End of the Open Bipolar Workshop OBip

[read more: 3rd Day Workshop: Special European Dot 5/Dot 7 Workshop]

Monday, 30 September 2013

[mos-ak] Call for Papers] 6th International MOS-AK/GSA Workshop Dec. 11, 2013 Washington DC

Together with the Organizing Committee and Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the 6th International MOS-AK/GSA Workshop Dec. 11, 2013 Washington DC. The specific workshop goal will be to classify the most important directions for the future development of the electron device models, not limiting the discussion to compact models, but including physical, analytical and numerical models, to clearly identify areas that need further research and possible contact points between the different modeling domains (Technology TCAD, SPICE/Verilog-A standardization, advanced IC designs) . A freewheeling session will be also organized to review modeling activities of the CMC, NEEDS NanoHub and MOS-AK Groups.

Topics to be covered include the following:
  • Advances in semiconductor technologies and processing
  • Compact Modeling (CM) of the electron devices
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • CM of passive, active, sensors and actuators
  • Emerging Devices, CMOS and SOI-based memory cells
  • Microwave, RF device modeling, high voltage device modeling
  • Nanoscale CMOS devices and circuits
  • Technology R&D, DFY, DFT and IC Designs
  • Foundry/Fabless Interface Strategies
Speakers provisionary list (in alphabetic order)
  • Keith Green, TI, CMC Chair (US)
  • Benjamin Iniguez, URV (SP)
  • Eric Keiter, Xyce Team, Sandia (US) 
  • Luca Larcher, Uni. Modena (I)
  • Mark Lundstrom, NEEDS, NanoHub (US)
  • Michael Shur, RPI (US)
  • Sadayuki Yoshitomi, Toshiba (J)
In the terms of participation, intending participants and authors should also note the following dates: 
  • Call for Papers - Sept. 2013
  • 2nd Announcement - Oct 2013
  • Final Workshop Program - Nov. 2013
  • MOS-AK/GSA Workshop - Dec. 11, 2013

Further details and updates: <http://www.mos-ak.org/washington_dc_2013/
Email contact: <workshops@mos-ak.org

- with regards - WG (for the MOS-AK/GSA Committee
===
Arbeitskreis Modellierung von Systemen und Parameterextraktion 
Modeling of Systems and Parameter Extraction Working Group 
http://mos-ak.org/
===

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Wednesday, 21 August 2013

Sunday, 18 August 2013

Semiconductor Device Characterization Engineer jobs

Indeed
Qualcomm  90 reviews - San Jose, CA
Interacts with other groups such as Design, Process, System, Reliability, and FA. 5+ years of related hands-on industrial experience....
Qualcomm - 5:25 AM
5+ years of related hands-on industrial design experience. Hands-on experience with device physics, device process, device characterization, and systems....
Qualcomm - 5:25 AM
IBM CORPORATION 1,821 reviews - Somers, NY
Possess working knowledge of semiconductor device development processes. Semiconductor Research and Development Process Improvement Engineer, IBM Corporation,...
New York Times - 8:27 AM

Tuesday, 13 August 2013

Fwd: 4 new Semiconductor Device Characterization Engineer jobs

Indeed

4 new jobs found
Knowledge of analog and mixed signal board level design including PCB layout guidelines a strong plus. Knowledge of both analog and digital video interface...
Intersil - 11:04 PM
GLOBALFOUNDRIES - Malta, NY
Technology related Bachelor's degree with 6 years experience ;. or Master's degree plus 5 years experience in process technology development area;....
GLOBALFOUNDRIES - 7:22 PM
Experience would be obtained through your educational level research and/or relevant job/internship experiences....
Intel - 2:45 PM
Quantum Solution - Sunnyvale, CA
Excellent proficiency of Cadence's custom IC design environment, analog/mixed signal circuit simulation (Spectre, Hspice, Ocean scripting, )....
Quantum Solution - 4:53 AM

Thursday, 8 August 2013

[mos-ak] [Final Program] 11th MOS-AK ESSDERC ESSCIRC Workshop with the keynote speaker Larry Nagel

Together with Prof. Andrei Vladimirescu, R&D Scientific Coordinator, the Organizing Committee and Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the 11th consecutive MOS-AK ESSDERC ESSCIRC Workshop on Sept. 20, 2013 in Bucharest (RO). The event will open next decade of enabling compact modeling R&D exchange.  

The final workshop program as well as all further details and updates are on-line: <http://www.mos-ak.org/bucharest/

- with regards - WG (for the MOS-AK/GSA Committee

MOS-AK Workshop Program

 9:00 - 12:00Morning Session - Chair: Prof. Andrei Vladimirescu, ISEP (F); UCB (USA)
O_1 Welcome and Workshop Opening
W. Grabinski
MOS-AK Group (EU)
T_2 SPICE - MOS-AK Keynote
Larry Nagel
Omega Enterprises Consulting (USA)
T_3 NGSPICE: recent progresses and future plans
Paolo Nenzi*, Francesco Lannutti*, Robert Larice**, Holger Vogt**, Dietmar Warning**
*DIET - Sapienza University of Roma (I), ** NGSPICE Development Team
T_4 KCL and Linear/NonLinear Separation in NGSPICE
Francesco Lannutti
DIET - Sapienza University of Roma (I) and NGSPICE Development Team

Coffee Break
T_5 Modeling Junction Less FETs
Jean-Michel Sallese, Farzan Jazaeri, Lucian Barbut
EPFL (CH)
T_6 HiSIM-Compact Modeling Framework
Hans Juergen Mattausch
Uni. Hiroshima (J)
P_7 The Correct Account of Nonzero Differential Conductance in the Saturation Regime in the MOSFET Compact Model
Valentin Turin*, Gennady Zebrev**, Sergey Makarov***, Benjamin Iniguez****, and Michael Shur*****
*State University-ESPC (RU),**MEPHI (RU),***SYMICA Inc (RU),****URV (SP),*****RPI (USA)
12:00 -13:00
Lunch Break
13:00 -16:00
Afternoon Session - Chair: W. Grabinski, MOS-AK Group
T_8 State of the Art Modeling of Passive CMOS Components
Bernd Landgraf 
Infineon Technologies (A)
T_9 Compact I-V Model of Amorphous Oxide TFTs
Benjamin Iniguez*,Alejandra Castro-Carranza* , Muthupandian Cheralathan* , Slobodan Mijalkovic**, Pedro Barquinha***, Elvira Fortunato***, Rodrigo Martins***,Magali Estrada****, and Antonio Cerdeira****
*URV (SP), **Silvaco Ltd (UK), ***UNL(P), ****CINVESTAV (MEX)

Coffee Break
T_10 Three-Dimensional Electro-Thermal Circuit Model of Power Super-Junction MOSFET
Aleš Chvála, Daniel Donoval, Juraj Marek, Patrik Príbytný and Marián Molnár
Institute of Electronics and Photonics, Slovak University of Technology in Bratislava (SK)
T_11 A Close Comparison of Silicon and Silicon Carbide Double Gate JFETs
Matthias Bucher, Rupendra Sharma
Technical University of Crete, Chania, (GR)
T_12 Towards wide-frequency substrate model of advanced FDSOI MOSFET
Sergej Makovejev, Valeriya Kilchytska, Jean-Pierre Raskin, Denis Flandre
UCL (B)
16:00
End of the MOS-AK Workshop

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Monday, 8 July 2013

[repost nanobuff] On compact modeling

Posted on June 27, 2013 on nanobuff
"While the modeling industry is full of software solutions for all sorts of things in the operation of electronics from the very low to the very high level, there seems to be very sparse tools for simulating radiation effects. This would be normal if there was little interest or public research on the subject, but that is not the case. The models are out there, most of the basic concepts have been examined lots of decades ago, so what is stopping the industry? I really don’t know and I will not even try to answer.

Having said that, I would also like to state that compact modelling, in the case of radiation effects, is at least beneath me. I recently found this old compact modelling project. It is like a plugin to the Silvaco software. How would a compact modelling platform work in the ever-reducing dimensions of today? Things get fairly uncertain below 0.1 µm gate lengths. We need 3D, we need quantum models etc. just for the operation. And for the radiation part? That is now a materials science problem, I guess. And if you decide to go Monte Carlo, that’s even more demanding. The problem seems to be a “chicken and egg” one. We need more processing power to be able to simulate our next generation electronics that will give us more processing power."

[Leave a Reply]

Friday, 5 July 2013

Third Berkeley Symposium on Energy Efficient Electronic Systems

Time: October 28 - 29, 2013
Place: Sutardja Dai Hall, UCB, California, USA

Message from Symposium Organizers
Once again, we look forward to hosting another Berkeley Symposium on Energy Efficient Electronic Systems, a forum that we founded in 2009. Biennially, we bring together researchers who are working on breakthrough improvements in energy efficiency for information processing systems. Our goal is that the Symposium continue to be a venue for the attendees to gain an integrated perspective of the challenges and advances in this domain of technology through sessions that cover the entire food chain, from devices to systems. As in the two previous symposia, we expect that the academic setting of UC Berkeley will encourage open exchanges of ideas, and foster closer cooperation and collaborations among the researchers.

For the first time, we welcome IEEE Electronic Devices Society as a technical co-sponsor. Also new, the 2013 Organizing Committee is issuing a Call for Papers. These changes are intended to broaden participation at the Symposium, thereby furthering the Symposium's goal of fostering information exchanges and collaborations.

We look forward to seeing you at the 3rd Berkeley Symposium on Energy Efficient Electronic Systems.

Eli Yablonovitch, Co-Chair, Organizing Committee
Jeffrey Bokor, Co-Chair, Organizing Committee

[Symposium Link]

Thursday, 4 July 2013

URSI-C Commission Workshop (Kawasaki)

Theme: "Simulation Techniques for wireless communication integrated circuit design" 

Sponsorship:
Sponsored by:
  • IEEE MTT-S Japan Chapter 
  • IEEE AP-S Japan Chapter 
  • IEEE VT-S Japan Chapter 
  • IEEE SSC-S Japan Chapter 
Date and time: Friday, 12:30 to 16:30, July 05, 2013
Location:  Toshiba Science Museum (directions from Komukaitoshiba town)
Entry fee: Free

Program
12:15 - 12:30 Reception
12:30 - 13:15 Toshiba Science Museum tour
13:30 - 13:40 Opening Remarks Masahiro Morikura (Kyoto University)
13:40 - 14:20 "High frequency modeling of the MOSFET, including the process variation" Yoshitomi Sadayuki (Toshiba)
14:20 - 15:00 "Challenges and Solutions for RFIC Realization"  Sugaya Hidehiko (Cadence Japan)
15:00 - 15:10 Break (10 minutes)
15:10 - 15:50 "Methodology for substrate coupling analysis with high frequency accuracy" Sotiris Bantas (Helic, Inc.)
15:50 - 16:30 "Behavioral technology of RF transceiver circuit" Takahiro Kikuchi (Agilent Technologies)
16:30 Closing
17:30 - social gathering

[read more...]

Thursday, 27 June 2013

[mos-ak] "Advances in Condensed Matter Physics" Special Issue on Device Modeling

Advances in Condensed Matter Physics is published using an open access publication model, meaning that all interested readers are able  to freely access the journal online without the need for a subscription. Moreover, the journal currently has an Impact Factor of 1.158.

 

This special issue focuses on novel advances in the broad field of device modeling. Models of semiconductor devices are used in circuit simulators in order to predict the functionality of circuits and are an important prerequisite for successful circuit design. The currently available semiconductor models are facing enormous challenges in modeling the observed physical phenomena in the sub-50nm technologies. The demand for advanced models, which can describe emerging devices necessary in the near future and can account for their physical effects, has led to enormous R&D efforts in the development of advanced physics-based models. These novel devices that can reduce the cost of the actual ones (by using organic materials) and/or improve their performances (low leakage, low power, and high speed in a smaller footprint) will be preferred in circuits, thus calling for accurate and reliable models, including new device specific effects. Modeling these devices is of high importance in order to analyze and predict the behaviour of emerging ones, without the high cost necessary to fabricate the real components. For some specific purposes, like power and timing analysis, it is really necessary to incorporate models at gate level, too. These models also suffer the effects of nanoscaling and are currently under intense development.


Potential topics include, but are not limited to:
  • Modeling the physical behaviour of novel silicon-based FETs (FinFETs, DG FETs, nanowires, junctionless FETs, tunneling FETs, variable barrier transistors, etc.)
  • Modeling the physical behaviour of graphene-based devices
  • Modeling the physical behaviour of organic semiconductor-based devices (OLEDs, junctions, TFTs, sensors, etc.)
  • Device and gate level model implementation for circuit simulations

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/acmp/guidelines/.

Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/acmp/rdsd/ according to the following timetable:

 

Manuscript Due  Friday, 13 December 2013

First Round of Reviews  Friday, 7 March 2014

Publication Date  Friday, 2 May 2014

 

Lead Guest Editor

Oana Moldovan, Universitat Rovira i Virgili, Tarragona, Spain

Guest Editors 

AlejandraCastro-Carranza, Universitat Rovira i Virgili, 43007 Tarragona, Spain

François Lime, Universitat Rovira i Virgili, 43007 Tarragona, Spain

Rodrigo Picos, Universitat de les Illes Balears. Cra. deValldemossa, km 7.5, Palma, Illes Balears, Spain

Bogdan Mihai Nae, Universitat Rovira i Virgili, 43007 Tarragona, Spain

Spiros Nikolaidis, Aristotle Universityof Thessaloniki, Thessaloniki, Greece

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Sunday, 23 June 2013

CMC @ Si2

The CMC as a member of the Si2 will continue its basic goal of examining, promoting and standardizing SPICE modeling efforts based upon business needs. CMC (see its Member List)  encourages developers to dwell on current and near-term problems that will advance compact modeling. They will continue to provide industry resources and funding for monitoring/mentoring compact model development.

[read more: CMC Presentation at DAC]

Friday, 21 June 2013

[mos-ak] 11th MOS-AK/GSA ESSDERC ESSCIRC Workshop with the keynote speaker Larry Nagel

Together with Prof. Andrei Vladimirescu, R&D Scientific Coordinator, the Organizing Committee and Extended MOS-AK/GSA TPC Committee, we have pleasure to invite to the 11th MOS-AK/GSA ESSDERC ESSCIRC Workshop on Sept. 20, 2013 in Bucharest (RO). The event will open next decade of enabling compact modeling R&D exchange.  

Speakers - previsionary list (in alphabetic order)
  • Larry Nagel
    • MOS-AK Keynote Speaker
  • Prof. Matthias Bucher, TUC Chania
  • Dr. Ales Chvala, STU Bratislava
  • Prof. Benjamin Iniguez, URV Tarragona
  • Prof. Hans Juergen Mattausch, Uni Hiroshima
  • Dr. Paolo Nenzi, Uni Roma, NGSpice
  • Dr. Jean-Michel Sallese, EPFL Lausanne
  • Prof. Valentin Turin, OSTU Orel
  • Prof. Andrei Vladimirescu, ISE Paris and UC Berkeley
In the terms of participation, intending participants and authors should also note the following dates: 
  • Call for Papers - May 2013
  • 2nd Announcement - June 2013
  • Final Workshop Program - July, 2013
  • MOS-AK/GSA Workshop - Sept. 20, 2013

Further details and updates: <http://www.mos-ak.org/bucharest/
Email contact: <workshops@mos-ak.org

- with regards - WG (for the MOS-AK/GSA Committee

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Friday, 14 June 2013

Jobs for modelling specialists

This time, in Paris:

Senior Modelling Engineer

Location:
Paris, France
Sector:
Contract:
Permanent
Salary:
€50,000 – €70,000
 
Look here for more information.

Tuesday, 11 June 2013

EU Goal: Reach 20% World-Share in Chip Manufacturing by 2020

EU to spend € 10 billion to trigger € 100 billion investments — SEMI provides the platforms for our members to share critical implementation issues and actions to support the goals set by the EU [H. Kundert, president, SEMI Europe] 

The new European industrial strategy for micro- and nano-electronics, published on 23 May 2013, sets the framework for targeted investment across the electronics value and innovation chain. An Industrial Strategy Roadmap for Investment, to be developed by end 2013, will cover three complementary lines:
  • Transition to 450mm, expected to primarily benefit equipment and material manufacturers in Europe
  • “More than Moore” on 200mm and 300 mm
  • “More Moore” for ultimate miniaturization on 300mm wafers
Investment will be concentrated, focusing on Europe’s clusters of excellence in manufacturing and design (Grenoble, Dresden and Eindhoven-Leuven), but will also support partnerships and alliances across the value chain in Europe.

[read more...] also don't miss the SEMICON Europa 2013 Call for Papers (open until June 27). The conferences are a great opportunity to present your technology and latest achievements to a large audience of industry professionals. For more information about SEMICON Europe programs, the Call for Papers and opportunities to exhibit and present your products please go online and visit semiconeuropa.org.

Thursday, 6 June 2013

Jobs for compact modelling specialists

Some jobs I've found while surfing the internet: (remember, we're not offering these jobs, only commenting on them!!).

(look at http://www.semiconductorjobs.com/a/jobs/find-jobs/q-compact+model+device for more information).


May 30 Modeling Engineering Manager TriQuint Semiconductor US Richardson, TX
device characterization measurement, device model parameter extraction, and model ... product design. Produce and maintain 'compact' models for GaAs and GaN RFIC... more
 
May 05 Spice Modeling Engineer Globalfoundries California
experienced Spice modeling engineer in the Compact Modeling & Characterization (CMC) ... Working closely with lab engineers on the device characterization (DC/AC/Transient/RF),... more
 
Mar 26 Compact Device Modeling Engineer Intel Hillsboro, OR
Title: Compact Device Modeling Engineer Location: USA-Oregon, Hillsboro Job Number: 705850 ... * Developing and maintaining compact device models in internal circuit... more

May 30 Senior Software Architect Xilinx San Jose, CA
Candidate will work in Device Modeling group in FPGA Implementation tools division of ... and coming up with new algorithms and compact data structures to represent Xilinx... more
 
May 23 Tcad device engineer Job Micron Boise, ID
In this position, you will be studying detailed process and device design/optimization usi ... - Experience/knowledge in CMOS process, deep submicron device physics, state of the art mo... more

May 17 Staff Engineer
Santa Clara, CA
special needs in device modeling (e.g. device measurement, reliability stress, and ... Knowledge in numerical device/process simulation and chip level extraction is a plus. more
 
May 15 Compact Device Modeling Engineer Job Intel Hillsboro, OR
involves developing state-of-the-art compact device models and working in a highly ... - Developing and maintaining compact device models in internal circuit... more






Saturday, 1 June 2013

[mos-ak] Si2 Announces Acquisition of the Compact Model Council

Standard SPICE Models, API, and Language Foundational to Industry

AUSTIN, Texas — (BUSINESS WIRE) — May 31, 2013 — The Silicon Integration Initiative (Si2) has announced the acquisition of the Compact Model Council (CMC). The CMC, formed in 1996, develops and standardizes compact models of electronic devices used within commercial circuit simulators across the electronics industry, including virtually all SPICE-class simulation. The CMC will be renamed the Compact Model Coalition to blend with Si2's organizational structure. The CMC, represented by 37 member companies, supports 20 active subcommittees and has produced over a dozen widely-used standard device models, modeling API, and SPICE language standard.

Details of the transfer and future plans will be presented at the Design Automation Conference (DAC) to be held in Austin, TX from June 2-6. The first presentation will be at the Si2 25th Anniversary Luncheon Celebration on June 3, 12-1:30 PM in Room 9ABC in the Austin Convention Center. The luncheon is free of charge. Other presentations are scheduled in the Si2 Booth #1427 on the DAC exhibit floor at: June 4 - 10:30AM and 4:30PM, and June 5 - 1:30PM. More information on this and other Si2 events can be found at this link: http://www.si2.org/?page=1544

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Wednesday, 22 May 2013

[mos-ak] Workshop on Compact TFT Modeling for Circuit Simulation

Call for Papers
5th International Workshop on Compact Thin-Film Transistor (TFT) Modeling for Circuit Simulation (CTFT)
CEA-LITEN, MINATEC Campus, Grenoble, France, June 21, 2013

In recent years, the increasing use of active matrix flat-panel displays and bio-medical imagers in commercial electronic products has drawn a significant attention to thin-film transistors (TFT) and technologies. TFTs on amorphous- and poly-silicon as well as newly emerging organic, transparent metal oxide and nano-composite semiconductor technologies are becoming increasingly common. For example, flat panel displays are finding widespread use in many products such as cellular phones, personal digital assistants (PDAs), camcorders, laptop personal computers (PCs), to name a few. The active matrix display is composed of a grid or matrix of picture elements called as "pixels". Thousands or millions of these pixels together create an image on the display, in which the TFTs act as switches to individually turn each pixel. More increasingly TFTs are starting to be used as analog circuit elements for rudimentary signal conditioning. Therefore, physically-based compact modeling of TFTs for circuit simulation is crucial to accurately and reliably predict TFT behavior in the active matrix. A concentrated R&D effort is critical for developing physically-based compact TFT models for emerging thin-film technologies, and significant R&D efforts along these lines are underway world-wide.

The CTFT workshop will provide a forum for discussions and current practices on compact TFT modeling. The 2013 CTFT workshop edition will be held on June 21 in Grenoble (France) in combination with the 9th International Conference on Organic Electronics (ICOE, June 18-20, www.icoe2013.org ). The CTFT workshop is sponsored by IEEE EDS Compact Modeling Technical Committee in joint collaboration with CEA-LITEN, the Universitat Rovira i Virgili (Tarragona Spain) and the University of Cambridge (UK).

A partial list of the areas of interest includes:
  • Physics of TFTs and operating principles
  • Compact TFT device models for circuit simulation
  • Model implementation and circuit analysis techniques
  • Model parameter extraction techniques
  • Applications of compact TFT models in emerging products
  • Compact models for interconnects in active matrix flat panels
Abstract (500 Word) Submission deadline:  May 24, 2013
Prospective authors should submit a 500-word abstract to: Bogdan Mihai Nae (nae.bogden@urv.cat)
Submission of a 1-page or 2-page single-column paper to be included in proceedings: June 8, 2013.
Download the word template here for the 1-page or 2-page final version of the paper.

 

Committee Members      

Anis Daami, CEA-LITEN, France (General Co-Chair)

François Templier, CEA-LITEN, France (General Co-Chair)

Vincent Fischer, CEA-LITEN, France

Arokia Nathan, Cambridge University, UK

Benjamin Iniguez, Universitat Rovira i Virgili, Spain

Jamal Deen, McMaster University, Canada

Bill Milne, Cambridge University, UK

Andre Sazonov, University of Waterloo, Canada

John Robertson, Cambridge University, UK

Xiaojun Guo, Shanghai Jiaotong University, China

Flora Li, Polymer Vision, The Netherlands

Hyun Jae Kim, Yonsei University, Korea

Samar Saha, Silterra Corp., USA

Zhou Xing, Nanyang Technological University, Singapore

Norbert Fruehauf, University of Stuttgart, Germany

Peyman Servati, University of British Columbia, Canada

Man Wong, HKUST, Hong Kong

 

 

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