Wednesday, 30 June 2010

Job offers in LinkedIn

Remember: this is only a copy of a post in LinkedIn. We're not associated in any way to any of them...


Senior Research & Development Engineer
Group: Silicon Engineering Group
Location: Hyderabad, India
Contact @ akshat.kumar@synopsys.com

This position is for a senior R&D engineer who will join the TCAD team and work on the development and maintenance of state of the art back-end/interconnect analysis tools. Primary responsibilities include designing and developing physical models and numerical algorithms and implementing these algorithms in general purpose multidimensional semiconductor back-end/interconnect simulators in C++.
- PhD in a relevant field.
- Exp. with semiconductor back-end/ interconnect simulation tools focusing on one or, more of electrical, thermal, mechanical, and reliability analysis, numerical methods for solving partial differential equations (finite element and/or finite volume method), mesh generation.
- ~3 to 5 years of experience as a developer on large Finite Element Analysis simulators in either a commercial, or industrial/research lab setting. Prior experience with Synopsys TCAD tools is strongly preferred.
-Software development experience in C++ and preferably Tcl/Tk.
-Good communication skills and the ability to work within a team are essential.

Monday, 28 June 2010

some reading for summertime

Appl. Phys. Lett. 96, 253301 (2010); doi:10.1063/1.3453661 (3 pages)

Current bistability and carrier transport mechanisms of organic bistable devices based on hybrid Ag nanoparticle-polymethyl methacrylate polymer nanocomposites

Won Tae Kim, Jae Hun Jung, Tae Whan Kim, and Dong Ick Son
Abstract:The current bistability and the carrier transport mechanisms of organic bistable devices (OBDs) using Ag nanoparticle-polymethyl methacrylate (PMMA) nanocomposites have been investigated. Current-voltage measurements at 300 K on the Al/Ag nanoparticles embedded in the PMMA layer/indium-tin-oxide devices exhibit a current bistability with an ON/OFF ratio of 103. Write-read-erase-read sequence results demonstrate the switching characteristics of the OBD. The cycling endurance number of the ON/OFF switching for the OBD is above 7×104. The current bistability and carrier transport mechanisms of the OBD fabricated utilizing hybrid Ag nanoparticle-PMMA polymer nanocomposites are described on the basis of the experimental data.



Quantum transport modeling of defected graphene nanoribbons 
 I. Deretzis, G. Fiori, G. Iannaccone, G. Piccitto and A. La Magna


Abstract: We study backscattering phenomena during conduction for graphene nanoribbons of μm lengths, from single vacancy scatterers up to finite defect concentrations. Using ab initio calibrated Hamiltonian models we highlight the importance of confinement and geometry on the shaping of the local density of states around the defects that can lead to important alterations on the transport process, giving rise to impuritylike conduction gaps in the conductance distribution. Within a statistical analysis of finite defect concentration we show that conductance degradation can become very important.




 Solid-State Electronics
The spatial origin of current noise in semiconductor devices in the framework of semiclassical transport
C.E. Kormana, B.A. Noaman

Abstract: A new model to semiconductor device electronic noise is presented in the framework of semiclassical transport theory. The salient feature of this model is that it connects the current noise characteristics directly to the physics of scattering of the semiclassical transport theory and makes no additional assumption regarding the nature of noise. Employing this approach, this work investigates the spatial origin of the current noise across two semiconductor structures. In this approach the terminal current noise is directly related to carrier scattering inside the device, which is accounted for in the Boltzmann transport equation (BTE), without the need to add Langevin noise terms to the calculations. Accordingly, it utilizes the well-established spherical harmonics expansion (SHE) technique to solve the BTE, and it combines analytical and numerical methods, in contrast with the Monte Carlo (MC) approach that employs ensemble averages of randomly generated events. The model leads to the solution of a time-dependent transient solution of the BTE with special initial and Ohmic boundary conditions that is solved in the frequency domain to directly compute the terminal current noise spectral density. It is also shown that with this approach the Nyquist theorem under thermal equilibrium conditions is recovered.

 

Wednesday, 23 June 2010

The Ten Commandments for Effective Standards

The Ten Commandments for Effective Standards:
Practical Insights for Creating Technical Standards

Karen Bartleson (Author)

Publisher: Synopsys Press (May 7, 2010)
Language: English
ISBN-10: 1617300020
ISBN-13: 978-1617300028



About the Author:
Karen Bartleson has three decades' experience in the computer chip industry. She is known for her work in the area of standards for electronic design automation, and is also one of the pioneers into social media in her industry, including Twitter. She is the author of "The Standards Game," a blog focused on the standards arena. Karen holds a BSEE from California Polytechnic State University, San Luis Obispo, California, and was the recipient of the Marie R. Pistilli Women in Design Automation Achievement Award in 2002. Her Twitter handle is @karenbartleson. --This text refers to the Paperback edition.

Monday, 21 June 2010

MOS-AK/GSA ESSDERC/ESSCIRC Workshop in Seville on Sept. 17, 2010 // 2nd announcement

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MOS-AK/GSA ESSDERC/ESSCIRC Workshop: http://www.mos-ak.org/seville/
"Frontiers of the Compact Modeling for Advanced Analog/RF Applications"

The MOS-AK/GSA Workshop in Seville will be organized as an integral
part of the ESSDERC/ESSCIRC Conference. The MOS-AK/GSA Workshop is
HiTech forum to discuss the frontiers of the electron devices modeling
with emphasis on simulation-aware models. Original papers presenting
new developments and advances in the compact/spice modeling and its
Verilog-A standardization are solicited. Suggested topics include (but
are not limited to):
   * Compact Modeling (CM) of the electron devices
   * Verilog-A language for CM standardization
   * New CM techniques and extraction software
   * CM of passive, active, sensors and actuators
   * Emerging Devices, CMOS and SOI-based memory cells
   * Microwave, RF device modeling, high voltage device modeling
   * Nanoscale CMOS devices and circuits
   * Technology R&D, DFY, DFT and IC Designs
   * Foundry/Fabless Interface Strategies
On-line abstract submission is open with the deadline on July 15, 2010
http://mos-ak.org/seville/abstracts.php

Tentative list of the invited speakers (alphabetic order):
   * Raphael Clerc, MINATEC: Compact modeling of nanoscale MOSFETs:
beyond the drift diffusion approximation
   * Gilles Depeyrot, Dolphin Integration: Verilog-A Compact Model
Standardization
   * Tibor Grasser, TU Wien: Recent Developments in Device
Reliability Modeling
   * Benjamin Iniguez, URV: Advances in Multigate MOSFET Modeling
   * David Jimenez, UAB: Analytic surface potential and drain current
model for negative capacitance FETs
   * Bernabé Linares-Barranco, NMC: The EKV/ACM compact models for
mismatch modeling down to 90nm and for new emergent non-CMOS
nanotechnology FETs
   * Josef Watts, IBM: Modeling Standardization: Enabling the
worldwide design community
   * Sadayuki Yoshitomi, Toshiba: Device Level RF IC Design

Further details and updates: http://www.mos-ak.org/seville/
==========================================================
* Wroclaw: June 24-26 www.mixdes.org/Special_sessions.htm
* Tarragona: June.31-July.1  http://www.compactmodelling.eu/tc_programme.php
* Seville: Sept. 17  http://www.mos-ak.org/seville/
* California: Dec'2010 http://www.mos-ak.org/
==========================================================

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[mos-ak] MOS-AK/GSA ESSDERC/ESSCIRC Workshop in Seville on Sept. 17, 2010 // 2nd announcement

MOS-AK/GSA ESSDERC/ESSCIRC Workshop: http://www.mos-ak.org/seville/
"Frontiers of the Compact Modeling for Advanced Analog/RF
Applications"

The MOS-AK/GSA Workshop in Seville will be organized as an integral
part of the ESSDERC/ESSCIRC Conference. The MOS-AK/GSA Workshop is
HiTech forum to discuss the frontiers of the electron devices modeling
with emphasis on simulation-aware models. Original papers presenting
new developments and advances in the compact/spice modeling and its
Verilog-A standardization are solicited. Suggested topics include (but
are not limited to):
* Compact Modeling (CM) of the electron devices
* Verilog-A language for CM standardization
* New CM techniques and extraction software
* CM of passive, active, sensors and actuators
* Emerging Devices, CMOS and SOI-based memory cells
* Microwave, RF device modeling, high voltage device modeling
* Nanoscale CMOS devices and circuits
* Technology R&D, DFY, DFT and IC Designs
* Foundry/Fabless Interface Strategies
On-line abstract submission is open with the deadline on July 15, 2010
http://mos-ak.org/seville/abstracts.php

Tentative list of the invited speakers (alphabetic order):
* Raphael Clerc, MINATEC: Compact modeling of nanoscale MOSFETs:
beyond the drift diffusion approximation
* Gilles Depeyrot, Dolphin Integration: Verilog-A Compact Model
Standardization
* Tibor Grasser, TU Wien: Recent Developments in Device
Reliability Modeling
* Benjamin Iniguez, URV: Advances in Multigate MOSFET Modeling
* David Jimenez, UAB: Analytic surface potential and drain current
model for negative capacitance FETs
* Bernabé Linares-Barranco, NMC: The EKV/ACM compact models for
mismatch modeling down to 90nm and for new emergent non-CMOS
nanotechnology FETs
* Josef Watts, IBM: Modeling Standardization: Enabling the
worldwide design community
* Sadayuki Yoshitomi, Toshiba: Device Level RF IC Design

Further details and updates: http://www.mos-ak.org/seville/
==========================================================
* Wroclaw: June 24-26 www.mixdes.org/Special_sessions.htm
* Tarragona: June.31-July.1 http://www.compactmodelling.eu/tc_programme.php
* Seville: Sept. 17 http://www.mos-ak.org/seville/
* California: Dec'2010 http://www.mos-ak.org/
==========================================================

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Sunday, 20 June 2010

SPICE update from Mentor

Daniel Payne talked with See-Mei Chan, Technical Marketing Manager at Mentor Friday morning because they couldn’t connect in Anaheim earlier this week. Daniel wanted to better understand what is new with Eldo, the SPICE circuit simulator at Mentor.

Read more in June 18th, 2010 post by Daniel Payne in Analog Fast SPICE, DAC 2010, Fast SPICE, SPICE circuit simulation.

Thursday, 17 June 2010

News and Views: Nature Nanotechnology

A. M. Ionescu
Nature Nanotechnology, vol. 5, iss. 3, pp. 178 – 179, March 2010


Figure (a) A junction FET is turned on in the (strong) inversion condition, when a channel of minority carriers is formed just under the gate, and junction barriers to their flow are reduced. The off state of the junction FET corresponds to high junction barriers and the suppression of the inversion channel. The horizontal red line shows the bottom of the depletion region, and the slanted red lines indicate the limits of the depletion region controlled by the gate. (b) In contrast, the on state of a junctionless FET is obtained in 'flat band' conditions, with majority carriers travelling through a highly doped film. The device (which requires a thin-film silicon-on-insulator substrate) turns off when the gate-controlled depletion extends over the whole film. Both devices operate with the source grounded and a positive potential applied to the drain. Vt denotes the threshold voltage (positive for the n-type devices). Similar descriptions apply to the operation of complementary p-type FETs. Blue and red colours depict electron and hole doping respectively, with a darker colour indicating heavier doping. The white regions correspond to the depletion regions, and the green colour represents the gate oxide.

References
  1. Lilienfeld, J. E. Method and apparatus for controlling electric current. US patent 1,745,175 (1925)
  2. Shan, Y., Ashok, S. & Fonash, S. J. Appl. Phys. Lett. 91, 093518 (2007)
  3. Lin, Y.-W., Marek-Sadowska, M., Maly, W., Pfitzner, A. & Kasprowicz, D. in Int. Conf. Computer Design 557–562 (IEEE, 2008)
  4. Soree, B. & Magnus, W. in 10th Int. Conf. Ultimate Integration of Silicon 245–248 (IEEE, 2009)
  5. Lee, C. W. et al. Appl. Phys. Lett. 94, 053511 (2009)
  6. Colinge, J. P. et al. Nature Nanotech. 5, 225–229 (2010)
  7. Tsutsui, K. et al. in Int. Workshop Nano CMOS 56–68 (IEEE, 2006)
  8. Aoyama, T. et al. in Int. Workshop Junction Technol. 110–115 (IEEE, 2009)
An interesting (educative?) post in EDN by Paul Rako :

Op-amp Spice macro-models article from Intersil

June 16, 2010
Former EDN analog editor Bill Schweber has published a good article from Tamara Schmitz and Jian Wong about developing Spice macromodels for voltage-feedback op-amps. Part 1 (pdf), and part 2 (pdf). All the youngsters like to use Spice for op-amp circuit design but I am more like Bob Pease and Jim Williams, you have to build the circuit to know what is going on. I will never forget being perfectly happy with a Spice run, until I built the circuit and realized that the quad op amp was running way too hot. I did not notice the power consumption of each of the amps was about ¼ W. That was a newbee mistake, sure, but even if Spice does not lie, it is the product of digital and software minds, so rather than flashing a big red sign that warns you that you are going to burn up the quad op amp, they just require you to define a power variable and display it and then print the result in the same tiny test and the blizzard of other information. Then software people smile and fold their arms and tell us everything is our fault, since the information was right there if only we asked for it.  The one thing about analog is that is has a sense of importance. That’s why steering wheels and shift levers are big and prominent and radio treble controls are tiny little buttons. If software people designed cars everything would be a tiny little icon and the crash warnings would be in 10-point text.
So anyway, Spice does not necessarily lie like Bob Pease says, but I guarantee you that if you give it poor models it will give you the wrong answer. This is the big hassle with op amp models. Some of them, like the old National Semi Comlinear models (pdf) published by Mike Steffes before he left for Burr Brown and now Intersil were essentially transistor-level models. An IC designer could infer the design of the part from them. Mike told me that he knew that, but it was just so important to give an accurate model that he felt he had to release those great models. If someone wanted to copy the circuits, well, they had a lot more work to do-anyone can de-cap an op amp and reverse engineer it in a day. That still does not give you the process or the testing regime or the design secrets and tricks.
That is why this Intersil article is so important. Anything that helps you make good models is important in a world where kid engineers trust a computer rather than a breadboard. The article give some history of op amp models and that will tip you off as to what you can expect from a simulation. If the model you use does not model for 1/f noise, and most vendor models do not, you cannot get a meaningful simulation of low-frequency noise performance of the circuit. If the model does include flat-band noise and you are designing and ac-coupled video circuit, well that is fine for your needs. I have yet to see a Spice op-amp model that accurately tells you what happens if you bang the output into the rails and saturate the transistors. I will ask Mike Steffes if his old Comlinear models would do that, and leave a comment.

Tuesday, 15 June 2010

Modeling The Bipolar Transistor (Book)

Modeling The Bipolar Transistor (*)
By Ian Getreu
(2009; Paperback, 286 pages)

The book describes the bipolar transistor model and parameter measurement techniques for the SPICE circuit simulator. Originally published by Tektronix in 1974, this is a slightly modified revision republished in 2009 by the original author.

Read the review by Colin McAndrew

(*) There is a $4.00 discount if people order it by June 30 - use the coupon code: SUMMERREAD305.

Friday, 11 June 2010

IEEE Awards 2010


Takayasu Sakurai, has got the 2010 IEEE Donald O. Pederson Award in Solid-State Circuits, for pioneering contributions to the design and modeling of high-speed and low-power CMOS logic circuits.



Note that this is not compact modeling, but his alpha power law model has had a big impact!


Gennady Gildenblat has got promoted to IEEE Fellow for his "contributions to modeling of metal-oxide semiconductor field effect transistors".

Yasuhisa Omura has got promoted to IEEE Fellow for the contributions made to the SOI technology, analysis and modelling.

Thomas Piotr Skotnicki also got the promotion to IEEE Fellow for contributing to the development of MOS models.



Congratulations to all of them!

Tuesday, 8 June 2010

Physicists from Mainz University develop a quantum interface between light and atoms



Ultra-thin glass fiber enables the controlled coupling of light and matter / publication in Physical Review Letters:

E. Vetsch, D. Reitz, G. Sagué, R. Schmidt, S. T. Dawkins, and A. Rauschenbeutel
Optical interface created by laser-cooled atoms trapped in the evanescent field surround-ing an optical nanofiber
Physical Review Letters, May 21, 2010
DOI: 10.1103/PhysRevLett.104.203603

Monday, 7 June 2010

2010 IEDM CALL FOR PAPERS

Submission Deadline is June 25, 2010!

The IEEE International Electron Devices Meeting is the Annual Technical Meeting of the Electron Devices Society.  This year it will be held at the Hilton San Francisco Union Square, San Francisco, CA USA December 6-8, 2010.

Increased participation in the areas of energy harvesting, power devices, biomedical devices and circuit-technology interaction is desired.

Information about IEDM can be found at: http://www.ieee-iedm.org

Social Networking: 
Twitter: http://twitter.com/ieee_iedm
 
Facebook:
http://www.facebook.com/search/?q=IEDM&init=quick#/pages/IEDM/131119756449?ref=search&sid=6112806.762392748..1



MEETING HIGHLIGHTS 
 * Three plenary presentations by prominent experts. 
 * Invited papers on all aspects of advanced devices and technologies. 
 * An Emerging Technology session. 
 * Panel discussion.
 * Presentation of IEEE/EDS awards. 
 * IEDM Luncheon presentation will be held on Tuesday, December 7.
 * Two short courses will be held on Sunday December 5.

Abstract Submission
 * Web-based submission of abstracts (http://www.ieee-iedm.org)
 * Deadline for submissions is June 25, 2010 

For further information on submissions, go to http://www.ieee-iedm.org and click on call for papers.  Download the pdf of the call for papers with more detailed information.

Questions/Comments, contact the IEDM Conference office at:
phyllism@widerkehr.com or 301-527-0900 ext. 2

Thursday, 3 June 2010

Training Course on Compact Modeling: Final Programme

The first edition of the Training Courses on Compact Modeling (TCCM) will be held in Tarragona (Catalonia, Spain) on June 30-July 1, in coordination with two other events partially or totally related to compact modeling: the 8th Graduate Student Meeting on Electronic Engineering (June 28-29) and the 3rd International Workshop on Compact Thin Film Transistor Modeling (July 2).

The Training Course will consist on 12 lectures addressing relevant topics in the compact modeling of advanced electron devices. In particular, emphasis will be given on MOSFETs (bulk, SOI, Multi-Gate and High Voltage MOS structures) and HEMTs.

The Training Courses on Compact Modeling are sponsored by the European Union FP7 “COMON” IAPP Project, the European Union FP7 NANOSIL Network of Excellence and the Universitat Rovira i Virgili in collaboration with the IEEE EDS Compact Modeling Technical Committee.


REGISTRATION IS OPEN

It is cheap and includes two lunches and one gala dinner. The advanced registration fee will be 100 Euro for students and 130 Euro for non-students. After June 13, the registration fee is 150 Euro for students and 180 Euro for non-students. Members of the teams participating in the COMON project are exempted from paying the fee, and members of teams participating in NANOSIL pay a reduced fee.

I want to remark that ON JUNE 30 AND JULY 1 THERE ARE NO SOCCER WORLD CUP MATCHES.

So, participants do not have to worry to miss soccer matches during the duration of the Training Course!


The final programme, with the timetable, is already available:


Day 1: June 30, 2010 (Wednesday)
8:15
Training Courses Opening
Benjamin Iniguez (Universitat Rovira i Virgili, Spain)
8:30
Statistical variability and corresponding compact model strategies
Asen Asenov (University of Glasgow)
9:45
Electrical characterization of SOI and Multi-Gate MOSFETs
Sorin Cristoloveanu (MINATEC and LETI, France)
11:00
Coffee Break
11:30
Transport modeling
Tibor Grasser (TU-Wien, Austria)
12:45
Analytical 2D and 3D electrostatic modeling
Tor A Fjeldly (UniK, Norway)
14:15
Lunch
15:15
Variability-conscious Circuit Designs for Low-voltage Nano-scale CMOS LSIs
Kiyoo Itoh (Hitachi, Japan)
16:30
GNU/Open Source CAD Tools for Verilog-A Compact Model Standardization
Wladek Grabinski
20:30
Gala Dinner






Day 2: July 1, 2010 (Thursday)
8:30
Analytical small-signal modeling
Benjamin Iniguez (Universitat Rovira i Virgili, Spain)
9:45
DC Parameter Extraction
Antonio Cerdeira (Cinvestav, Mexico)
11:00
Coffee Break
11:30
Compact, High Frequency Equivalent Circuit Models for GaN, SiC, GaAs and CMOS FET
Ilcho Angelov (Chalmers University, Sweden)
12:45
Noise modeling
Jamal Deen (McMaster University, Canada)
14:15
Lunch
15:15
Electro-thermal and reliability modeling
Renaud Gillon (On Semiconductor, Belgium)
16:30
Leakage power modeling for the reduction of power consumption in CMOS ICs
Massimo Poncino (Politecnico di Torino, Italia)
17:45
Training Courses Closing

And nice weather is usual in Tarragona at the end of June/beginning of July. Participants who spend a few more days in Tarragona can enjoy the nice beaches around, or doing sightseeing in the Tarragona area, Barcelona (only 100 Km far from Tarragona) and other places in Catalonia.

Tarragona is well connected to Barcelona by rail and highway. There are direct buses from Barcelona Airport. Besides, there are direct flights to Reus Airport (less than 15 Km far from Tarragona) from many European cities by Ryanair.

STM confirms 20nm by end of 2012

The chief technology officer at STMicroelectronics, Jean-Marc Chery, today confirmed at the Field Trip conference in London that its first 20nm process will be going into production at its French fab by Q4 2012. [more]

Intel's timbers could be shivered. In Q1 2010 alone ST had revenue of $2,323 million USD and it was the #1 EMEA semiconductor company in 2009.

Wednesday, 2 June 2010

Toshiba Invention Brings Quantum Computing Closer

Quantum computers are likely to be used initially to solve problems that are otherwise virtually intractable, such as modeling new molecules in pharmaceuticals. The Toshiba team, working with the University of Cambridge's Cavendish Laboratory, described their invention in a paper in the journal Nature.

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Tuesday, 1 June 2010

Fastest Integrated Circuit Doubles the Previous Record, Getting Close to One Terahertz


The 670 GHz compact circuit layout (right), alongside a detail of Northrop Grumman's 30-nanometer Indium Phosphide T-gate (left). Northrop Grumman [more]