Tuesday, September 30, 2008
The IEEE Symposium on VLSI Technology is one of the most prestigeous conferences on VLSI devices and processes. It is also a very competitive and tough conference. Papers should always be innovative enough regarding VLSI devices. Some of the topics explicitly mentioned in the Call for Papers are "processes and device modeling of VLSI devices" and "theories and fundamentals" related to VLSI devices. Therefore, researchers in device modeling (including compact modeling) can submit papers to the IEEE Symposium on VLSI Technology, but it should be remarked that these models or theories should be real breakthroughs.
The deadline is January 14.
There will be a Best Student Paper Award. The Symposium will cover the travel mexpenses and registration fee for the award recipient to attend the 2009 Symposium.
The IEEE Symposium on VLSI Technology will be held in conjunction with the IEEE Symposium on VLSI Circuits, which is one of the top conferences in the field of integrated circuits. This Symposium is also very demanding and competitive. Papers should be really breakthroughs to be accepted.
Besides, a satellite workshop, the 2009 Silicon Nanoelectronics Workshop, will be held at the same location as the VLSI Symposia on June 13-14 2009.
Well, despite the symposium is so demanding, it is worthy to work hard to make a suitable paper for this Symposium. And it is also a good opportunity to enjoy some days in Kyoto, one of the most beautiful cities in Japan!
Topics include compact models for RLCK interconnects, Cu/low-K technologies, Carbon nanotube interconnects and Graphene Nano-Ribbon interconnects, RF and Microwave, 2D/3D compact interconnect models, interconnect modeling for SoC design, interconnect variability and statistical modeling,...
The deadline for paper submission is January 16 2009.
The candidate should have a Ph D in Electrical Engineering, Electronic Engineering, Telecommunication Engineering, Physics, or related disciplines.
The candidate should have enough research experience in the field of semiconductor devices, and must have a very good knowledge of the physics of electron devices. The research project to be carried out can be adapted to the candidate's profile. In any case, it will be related to the European project which will fund this position. Our contribution in these projects is the physics and modeling (in particular compact modeling) of the novel devices addressed by this European project: multi-gate MOSFETs (FinFETs, DG MOSFETs,...), High Voltage MOSFETs and advanced HEMTs.
The postdoc position, which will be a contract, will have a duration of at least 18 months (maybe up to 24 months). The net salary will be around 2000 Euro/month.
Interested applicants should send me their CV by e-mail.
DEADLINE TO RECEIVE APPLICATIONS: October 31 2008
MY E-MAIL ADDRESS IS: firstname.lastname@example.org
Nanoelectronics and Photonics Systrems Group (NEPHOS)
Department of Electronic Engineering
Universitat Rovira i Virgili (URV)
Avinguda dels Paisos Catalans 26
ISCAS is the largest conference in the area of Circuits and Systems. It is sponsored by the IEEE Circuits and Systems Society. Prestigeous speakers in this field are always invited.
ISCAS 2009 will focus on circuits and systems for Human Centric Smart Living Technologies, including mobile communications, multimedia systems, sensor interface, and biosystems.
The deadline for regular paper submission is October 10 2008 As indicated in the Call for Papers, the scope of ISCAS 2009 includes all topics related to integrated circuits and systems. Papers on compact modeling for circuit design are considered to address some of the topic of the call. In fact, every year a number of interesting papers on compact modeling are presented at ISCAS.
It is important to mention that in ISCAS posters are very well considered, as important as oral presentations. Many authors choose poster as their presentation format.
On the other hand, a "a very entertaining social program is planned. Special tours to tourist attractions will be available to the Symposium attendees and their guests." It Sounds promising, anyway.
Monday, September 29, 2008
ITC is an annual conference which addresses all topics related to Thin Film Transistors (TFTs), from process to circuits, also including simulation and compact modeling.
Abstracts should be submitted not later than November 30 for evaluation.
A number of talks will be given by prestigeous invited speakers.
Key Dates / Schedule
First Call-for-Papers.......................................................................Sep.15, 2008
Submission of Short Abstract........................................................Nov.30, 2008
Acceptance Notification...................................................................Jan.1, 2009
Submission of camera ready manuscript..........................................Feb.1, 2009
Advance Registration.......................................................................Feb.1, 2009
Separate Cover letter
Title of Paper Oral/Poster Preference
Full name, complete mailing address, email address, telephone and fax number of the principal author
Name, Affiliation, city, state, country of additional authors
Objective and Background: Briefly describe the goals and intent of your project and give background
factors that led to the new results
Results: Describe, in detail, the specific results that will be presented at the ITC’09.
Impact: Discuss the significance of your work and compare your findings with previously published
All interested authors are requested to submit abstracts for evaluation via the ITC ’09 web site.
No doubt ITC 2009 will be a very interesting conference. Besides, ITC '09 will be held jointly with the SID Mid-Europe Chapter Spring Meeting, an annual meeting attracting many European display professionals.
Saturday, September 27, 2008
The 2009 IEEE International Reliability Physics Symposium (IRPS) will be held in Montreal, Quebec, Canada, on April 26-30 2009. The venue will be The Fairmont Queen Elizabeth hotel.
For over 40 years, IRPS has been the premier conference for engineers and scientists to present new and original work in the area of microelectronic device reliability. IRPS is now co-sponsored by the IEEE Reliability Society and the IEEE Electron Devices Society. This co-sponsored event has drawn participants from the United States, Europe, Asia and all other parts of the world. IRPS 2009 promotes the reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechanisms in the user’s environment, while demonstrating the latest state-of-the-art developments in electronic reliability.
The focus of the symposium is the 3-day plenary/parallel sessions featuring original work that identifies new microelectronic failure or degradation mechanisms, improves understanding of known failure mechanisms, demonstrates new or innovative analytical techniques, or demonstrates ways to build-in reliability. Specific areas to be addressed during the 2009 IRPS are reliability concerns associated with silicon (integrated circuits, discrete devices, MEMS), non-silicon (bipolar, BiCMOS, LEDs and diode lasers, optical fiber and flat panel displays), and emerging technologies including organic electronics and nanotechnology.The deadline for abstract submission is October 3 2008.
In the Call for Papers, it is said that IRPS can accept papers which "identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems".
Other opportunities at the symposium include:
- A 2-day Tutorial Program. Attendees have the opportunity to learn a new area in some technical depth from an industry expert or brush up on the fundamentals with introductory tutorials. There are typically about 20 tutorials that are offered on topics ranging from back-end reliability to gate dielectric and transistor reliability to circuit/product reliability to assembly/ packaging reliability.
- Reliability Year-In-Review Seminars. These seminars provide a summary of important work published from the previous year in key reliability areas. Industry experts serve as the “tour guide” and save you time by collecting and summarizing this information to bring you up to date in a particular area as efficiently as possible.
- Evening Session Workshops enhance the synergy of the symposium by affording the attendees an opportunity to meet in informal groups to discuss key reliability physics topics with the guidance of experienced moderators. Some of the workshop topics are directly coupled to the tutorial program to allow more discussion on a particular topic.
- Equipment Demonstrations held in parallel with tutorials and technical sessions are a unique aspect of this symposium. Manufacturers of state-of-the-art analytical and test and stress equipment are on hand to demonstrate their products and systems to individuals and small groups. Attendees are encouraged to bring samples or questions for onsite analysis and discussion.
- An Evening Poster Session has become an important part of the IRPS for authors and attendees to discuss recent research and results in a very interactive environment.
This MQ is focused on the emerging compact device and interconnect models. Six EDS distinguished lecturers have been invited:
J. J. Liou: "Compact modeling of silicon controlled rectifier for electrostatic discharge (ESD) computer aided design applications"
M. J. Deen: "Noise issues in advanced silicon devices and circuits"
N. Sadachika: "Modeling and characterization of RF/analog and noise using HiSIM2"
B. Yu, Y. Taur, J. Song: "Compact modeling of multiple-gate MOSFETs"
L.F. Register: "Nanoscale MOSFET physics: Observations from non-compact modeling studies"
P.K. Yu: "Wafer bonding for heterogeneous integration"
The Chair person will be Samar Saha, IEEE EDS Compact Modeling Technical Committee Chair, from Silterra USA Inc., San Jose, CA.
Friday, September 26, 2008
In December 2008 a MOS-AK meeting will take place in San Francisco, California, co-located with two important events: the Compact Modeling Council (CMC) Meeting and IEDM'2008.
The call for abstracts is open. If you are interesting in making one presentation, please contact Wladek Grabinski: ")'>
The MOS-AK meeting is one of the main forums on compact modeling in Europe. So far, two editions of the meeting were held: one in spring and another one in September, co-located with the ESSDERC and ESSCIRC conferences. Of course, most of the participants use to be from Europe. It will be very interesting to have a MOS-AK meeting in the US, and have an active participation of compact model developers from America!
This Forum `be-flexible´ was created by Fraunhofer IZM-Munich to deal with the most recent research and innovations in the world of flexible electronics. It is an interesting event for exchanges of experiences of scientists, applied researchers, equipment suppliers and users in flexible electronics. It is also a good opportunity to meet people from the leading companies and suppliers.
The Forum will consist of two Workshops: Thin Semiconductor Devices (December 2) and Flexible Electronics Systems (December 3). Some interesting papers will be presented.
Besides, December 4 will be an Open Day to visit the Fraunhofer IZM facilities.
The program consists of nine parallel symposia: Flexible Displays, Inorganic-Organic Hybrids, Lighting & Signage, Bateries & Printed Power, Organic Photovoltaics, Organic Based Sensors, Labels & Tags, and Smart Textiles.
The Global Plastic Electronics Conference and Showcase will be a very appropriate place to learn about the recent advances on plastic electronics, and also to do networking. The plenary speakers are leading authorities in the field, as well as some of the presenters.
The Call for Posters is still open! It is a good oportunity to present a scientific poster and have a chance to meet the leaders in plastic electronics.
Besides, more than 30 companies will participate in the Showcase. As said in the brochure, Science and Industry will meet in this conference.
The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.
The technical areas of RFIC 2009 include RFIC design, RFIC circuits, design methodology, system engineering, RF testing and packaging... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".
Certainly, RFIC'08, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.
The deadline for paper submission is January 6 2009.
IMS is the largest conference in the field of RF and microwave theory and techniques.
IMS'08 will include workshops, short courses, panels and special sessions
In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).
IMS will be part of the Microwave Week 2009, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.
The deadline for paper submission is December 8 2009.
Last but not least, IMS'08 includes a very interesting social programme.
Certainly Boston is an exciting city that offers many places and activities to enjoy!
The EUROSOI Workshop started as an event related to a former Coordination Action (called EUROSOI) funded by the European Commission. This Thematic Network, which includes most of the European teams working on SOI technology, will continue to exist at least until 2011, under the name of EUROSOI+, receiving more funding from the European Commission.
The EUROSOI Workshop has become an international forum to discuss the recent advances on all aspects of SOI technology: materials, devices, modeling, simulation and circuits.
EUROSOI 2008 will be organized by the Chalmers University. The Chairman is Prof Olof Engström, a recognized researcher in nanoscale semiconductor devices, including SOI technology.
The deadline for abstract submission is November 15 2008
Topics include all areas related to SOI technology, devices and circuits. The "SOI MOSFET modeling" topic is explicitly mentioned.
Göteborg is a leading conferences and event city in Europe. There is a strong joint commitment between the business community and the city council to support major events and conferences offering professionalism and excellent organizational skills.
Do not expect a very nice weather in Göteborg in January, but there are many things to see and enjoy in Göteborg.
The deadline for abstract submission is October 24 2008.
ISPSD is the main international conference on the areas of power semiconductor devices, power integrated circuits, their hybrid technologies, and applications.
Topics include: processes, materials, CAD/Simulation, devices, power ICs, packaging and applications.
For researchers interested in compact modeling of power semiconductor devices, ISPSD is a top event to present and get to know the last results in this field. "Device & circuit simulation" is explicitly mentioned as one of the subtopic in the "CAD/Simulation" topic. Compact modeling fits very well this subject. And of course, there is a subtopic of "Modeling" in the "Device" topic.
The Conference will take place mainly at the Axa Winterthur Auditorium but some parallel sessions will be held at the NH Constanza Hotel which is just beside the Auditorium.
Certainly Barcelona is a wonderful place to have such an important event. There are many superb attractions in Barcelona: historical landmarks, the well-known modernistic buildings in Gaudi-style, the "Barri Gòtic" (middle-age downtown), the Museum of Fine Arts, or the stadium of the Barça Football Club. And one can find nice beaches very close to Barcelona. The weather in June is usually very good, warm enough to go to the beach, without been too hot.
Monday, September 22, 2008
The IHP - Innovations for High Performance Microelectronics (Frankfurt Oder, Germany) invites applications for a position in CMOS Compact Modelling and Technology Support.
The IHP is seeking a candidate with a Master degree in Electrical Engineering or Physics. The main tasks will be:
The main tasks will be:
- SPICE compact modelling of CMOS based devices in IHPs 0.25µm and 0.13µm
- Electrical measurements and characterization on device level
- Automation of modelling and measurement procedures
- Support statistical analysis of electrical test data
The successful candidates must be highly motivated with basic knowledge in semiconductor device physics and electrical measurement and characterization.
Applicants have to send their application letter/e-mail by September 22, 2008 (if they arrive a few days later they may be considered too) including CV, copies of (scanned) certificates, and addresses of at least one referee to:
Dr. Christel Quick
Im Technologiepark 25
15236 Frankfurt (Oder)
Phone: +49 335 5625 330
Fax: +49 335 5625 666
The IHP is a non-profit making organization which pursues interdisciplinary application-oriented research in the fields of high performance microelectronics and communication, particularly Materials Research, Technology Research, Circuit Design and System Design.
This position offers a unique opportunity to work at the forefront of semiconductor technology in an upcoming new field. The IHP offers a challenging, multinational environment, with excellent career prospects.
Thursday, September 4, 2008
This edition will be held between March 30 – April 2, 2009, Mandalay Beach Resort, Oxnard, CA, USA, and there is a suggested topic including "Device and Circuit Modeling, Parameter Extraction", so it seems a nice opportunity to visit the USA, and California.... (no links included, because it is too well known a location)... but I include a picture of the hotel:
tempting, isn't it?