Tuesday, 30 October 2007

Jobs in compact modelling

More job offers: RF Magic and Kilopass... They are not as known as HP, but perhaps it is worth a look...

Urgent!!!! Job in Compact Modelling

The IHP - Innovations for High Performance Microelectronics

invites applications for a position in

Engineer for CMOS Compact Modelling and Technology Support
AZ 3102/07

The IHP consists of approximately 200 research staff, primarily in the area of wireless communications, including SiGe-based technologies, diagnostics, and materials research. We are working in a multidisciplinary environment, spanning materials, process technology, circuits, and systems. The IHP is housed in a state-of-the-art building 55 minutes from Berlin, with ultra-modern facilities. Our innovations are in worldwide demand.

We are seeking a candidate with a Master degree in Electrical Engineering or Physics in the field of CMOS compact modelling. The main tasks will be the characterization of advanced CMOS devices and extraction of SPICE models for IHP 0.25µm and 0.13µm technologies. Further he has to support statistical analysis of electrical test data.

The successful candidate will be highly motivated with good experimental, computing, and theoretical skills. Experience in semiconductor device physics and in one or more of the following fields would be an advantage: Compact modelling, Silicon IC technology, electrical parameter analysis.

The position offers a unique opportunity to work at the forefront of semiconductor technology in an upcoming new field. We offer a challenging, multinational environment, with excellent career prospects for highly motivated individuals. You will have the opportunity to establish an international reputation at the forefront of high tech.

The position will be filled as quickly as possible. Salary will be on the TV-L scale.

Please send your application letter/e-mail by October 31, 2007 including CV, copies of (scanned) certificates, and addresses of at least one referee to:

Dr. Christel Quick


Im Technologiepark 25

15236 Frankfurt (Oder)


Phone: +49 335 5625 330

Fax: +49 335 5625 666

Email: quick@ihp-microelectronics.com

For further information please contact:

Dr. Rene Scholz


Im Technologiepark 25

15236 Frankfurt (Oder)


Phone: +49 335 5625 647

Fax: +49 335 5625 327

E-mail: scholz@ihp-microelectronics.com

Monday, 29 October 2007

A Compact Model for OLEDs

An interesting paper in the last issue (91) of Applied Physics Letters from Ling Li, Gregor Meller, and Hans Kosina.
As they say: "The diffusion-controlled injection process in OLED is investigated and the concept of critical distance is proposed. A compact injection model applicable to OLED is formulated. This model is shown to fit the experimental data well and to explain the dependency of the injection current on the barrier height, the temperature, and the electric field. It was found that the field-dependent mobility plays an important role in the injection model at higher electric field."

Have a look here:

Diffusion-controlled charge injection model for organic light-emitting diodes
Ling Li, Gregor Meller, and Hans Kosina
Appl. Phys. Lett. 91, 172111 (2007) (3 pages)

Wednesday, 24 October 2007

A paper on FinFET circuits

In this month's issue of the IEEE Trans. on CAD, there is a very interesting paper from K.Roy et al, who present some interesting techniques to deal with FinFETs to create circuits. Have a look here. The model they present to estimate the current is an alpha-law one, but I should think the idea is nice and could be developed further using more complex (I mean, exact...) models.

Tuesday, 23 October 2007


Let me draw Your attention to the annual International Conference Mixed Design of Integrated Circuits and Systems (http://www.mixdes.org/), which has been organized in Poland since 1994 by the Department of Microelectronics and Computer Science, Technical University of Łódź, Poland. For the last 8 years, special sessions on Compact Modeling have been organized as an event accompanying MIXDES conferences. They have become a well recognized forum of CM knowledge exchange. Since their beginning Wladek Grabinski has been their chairman and main organizer. This year, he is being assisted by Daniel Tomaszewski in the session organization.

The next edition of the MIXDES and of the special session on Compact Modeling will be held in Poznań, 19-21 June 2008. You are kindly invited to take part in this event which, I am sure, will enrich you with many satisfying experiences, including, why not, visiting the beautiful old quarter of Poznán, with the cathedral and the old market.

Friday, 19 October 2007


The 4th International TFT Conference (ITC'08) will take place in Chungwoonkwan, Kyung Hee University, in Seoul, Korea, on January 24-25 2008.

ITC is an annual conference which addresses all topics related to Thin Film Transistors (TFTs), from process to circuits, also including simulation and compact modeling.

Abstracts should be submitted not later than October 30 for evaluation.

A number of talks will be given by prestigeous invited speakers, such as P. Miglorato, G. Fortunato, E. Fortunato, T. Someya, H. Matsumura, Y. Uraoka, or Y. Kuo.

No doubt ITC 2008 will be a very interesting conference. Last year it was held in Rome and it was quite successful. Besides, a number of papers presented in ITC'07 were selected to be published in a Special Issue of Solid-State Electronics.

Monday, 8 October 2007

First International Symposium on Flexible Electronics (ISFE)

The First International Symposium on Flexible Electronics (ISFE) will be held in from 6-9 April 2008 in Tarragona (Catalonia, Spain). This conference will provide an opportunity to present and discuss recent advances in all topics related to flexible electronics, from the material to the circuit and system levels. The enormous increase of the applications of Flexible Electronics makes it necessary to create such a conference. The scientific program consists of invited and contributed presentations as well as one poster session.

I will be the Chairman of the ISFE Symposium. Prestigeous researchers from academia and industry are members of the Organizing and Technical Committees: Prof. Michael S. Shur, Prof. Jamal Deen, Prof. Magali Estrada, Prof. Yue Kuo, Prof. Bill Eccleston, Prof. Takao Someya, Dr. Paul Heremans, Dr. Gerwin Gelinck, Dr. Hagen Klauk, Dr. Warren Jackson (HP), Dr. Euan Smith (CDT), Dr. Erik van Veenendal (Polymer Vision), Dr. Tolos Voutsas (Sharp Labs of America),...

Papers are solicited on the following topics:
Materials for Flexible Electronics, Processing for Flexible Electronics, Device technologies, Physics and Characterization of TFTs on flexible substrates, Amorphous and polycristalline TFT, Transparent TFT, Organic and polymer TFT, OLED physics and characterization, Numerical and compact modeling of TFTs and OLEDs, TFT circuits on flexible substrates, Flexible AM-LCDs, Flexible AM-OLEDs, Flexible PVDs, Flexible large-area sensors and actuators...

The deadline for abstract submission will be December 3 2007.

ISFE is organized by the Engineering Conferences International Foundation, together with the Universitat Rovira i Virgili (the university of Tarragona, to which the Chairman, that is, myself, belongs).

The conference will be held in the Hotel Imperial Tarraco, close to the historical centre of the city of Tarragona, in Catalonia (Spain). The hotel, with a high standard of comfort and select international cuisine, is overlooking the "Balcony on the Mediterranean", which offers a wonderful view over Miracle Beach on the Mediterranean sea.

Tarragona is located in the south of Catalonia, in the northeast corner of the Iberian Peninsula.
Tarraco (the Roman name for Tarragona) was one of the most important cities in the Roman Empire. On 30 November 2000, the UNESCO committee officially declared the Roman archaeological complex of Tàrraco a World Heritage Site. This recognition is intended to help ensure the conservation of the monuments, as well as to introduce them to the broader international public.

Speaking about Tarraco’s climate, the famous Roman poet Virgil wrote: "The climate blends and confuses the seasons singularly, so that all the year seems an eternal spring." Thanks to its temperate climate, with an average yearly temperature of 23ºC, its clean beaches with fine and gloden sand, and its singular artistic and architectural heritage, Tarragona is one of the most important tourism hubs in Europe.

I truly encourage researchers on flexible electronics to submit abstracts to ISFE, and have good chances to get to know the most recent developments in the field, to make useful networking and also to enyoy some days in the beautiful city of Tarragona!

"Be Flexible" 2007

The 2007 "Be Flexible" Forum will be held in Munich (Germany) on December 5-6 2007 at the Hotel Le Meridien (Munich).

This Forum `be-flexible´ was created by Fraunhofer IZM-Munich to deal with the most recent research and innovations in the world of flexible electronics. It is an interesting event for exchanges of experiences of scientists, applied researchers, equipment suppliers and users in flexible electronics. It is also a good opportunity to meet people from the leading companies and suppliers.

The Forum will consist of two Workshops: Thin Semiconductor Devices (December 5) and Flexible Electronics Systems (December 6). Some interesting papers will be presented. In the area of device physics and modeling, I want to mention a paper entitled "Conduction mechanisms in conjugated polymers", by N. Sedghi, M. Raja, D. Donaghy, and W. Eccleston, from the University of Liverpool. Prof. Eccleston's team is a pioneer in the field of physics and compact modeling of organic devices.

Besides, December 7 will be an Open Day to visit the Fraunhofer IZM facilities.

Fourth Annual Printed Electronics USA

The fourth annual Printed Electronics USA symposium will be held in San Francisco, California (in the South San Francisco Conference Center), on November 12-15. This conference aims to be the largest in the World on the topic of Printed Electronics. It covers both organic and printed inorganic electronics.

The premium conference will include more than 60 presentations from users/potential users, and a very large printed electronics exhibition, with over 50 exhibitors.

This conference focuses more on the potential and applications of printed electronics rather than on the physics and modeling of the devices for printed electronics. However, no doubt it will be a very interesting conference to attend for device researchers, in order to learn more about the revolutionary applications printed electronics is going to have.

The program will also include tours to local companies as well as half day Printed Electronics Investment Summit.

Besides, the 2007 Printed Electronics Awards, for recognition of industry and technology development, will be given.

Sunday, 7 October 2007

Global Plastic Electronics Conference

The 3rd Global Plastic Electronics Conference and Showcase will be held in Frankfurt, Germany, on October 29-30 2007. The venue will be the Sheraton Frankfurt Hotels & Towers, Conference Centre.

The program consists of nine parallel symposia: Flexible Displays, Lighting & Signage, Photovoltaics, Organic Based Sensors, Organic labels & Tags, Smart Packaging, Smart Textiles, Fuel Cells & Batteries and Hybrid Opportunities.

The Global Plastic Electronics Conference and Showcase will be a very appropriate place to learn about the recent advances on plastic electronics, and also to do networking. The plenary speakers are leading authorities in the field, as well as some of the presenters.

The Call for Posters is still open! It is a good oportunity to present a scientific poster and have a chance to meet the leaders in plastic electronics.

Besides, more than 30 companies will participate in the Showcase. As said in the brochure, Science and Industry will meet in this conference.


The 2007 IEEE International Conference on Computer Aided Design (ICCAD) is coming...
It will take place in San Jose, California on November 5-8. The venue will be the Double Tree Hotel in San Jose..

ICCAD is one of the top conferences in electronic design conference. This year it will be its 25th anniversary.

The program of the 25th Edition of ICCAD is truly interesting. On Monday 5 there will be 4 half-day tutorials and 1 full-day tutorial, all of them conducted by very prestigeous researchers. The selected papers are all of high quality. ICCAD is a very competitive conference, which carries out a careful selection of the papers submitted. Less than one third of the submissions are accepted.

Besides, there are there are 4 embedded tutorials addressing topics from nano-photonic circuits over physical synthesis and formal verification to compact device modeling for 45 nm and below.

The program will also be complemented with with 2 top-notch plenary keynote speakers: Jeff Welser, Director of the SRC National Nanoelectronics Research Initiative, and John Kibarian, CEO of PDF Solutions.

Modeling is one of the topics of ICCAD. One of the embedded tutorials will address compact device modeling for 45 nm and below, and it will be presented by Kevin Cao and Colin McAndrew. But in ICCAD other modeling issues are emphasized: power modeling, reliability modeling, interconnect modeling , variability modeling, and timing modeling.

In fact, one of the tutorials is entitled Modeling Deterministic Timing and Reliability Effects in Sub-65 nm Flows, and will be conducted by S. Pullela, C. Kashyap and B. McGaughy.

Certainly ICCAD will be a very interesting place to learn and discover the latest new research developments in electronic design technology, and to exchange ideas about the challenges and solutions for the design nanoscale integrated circuits.

And Happy Birthday to ICCAD!

2008 IEEE Symposium on VLSI Technology

The 2008 IEEE Symposium on VLSI Technology will take place in the Hilton Hawaiian Village, in Honolulu, Hawaii, on June 17-19.

The IEEE Symposium on VLSI Technology is one of the most prestigeous conferences on VLSI devices and processes. It is also a very competitive and tough conference. Papers should always be innovative enough regarding VLSI devices. Some of the topics explicitly mentioned in the Call for Papers are "process/device modeling" and "theories and fundamentals" related to VLSI devices. Therefore, researchers in device modeling (including compact modeling) can submit papers to the IEEE Symposium on VLSI Technology, but it should be remarked that these models or theories should be real breakthroughs.

The Chairman is Professor Jason Woo, from UCLA, an outstanding researcher in semiconductor devices, with a lot of experience in device modeling.

The deadline is January 7.

There will be a Best Student Paper Award. The Symposium will cover the travel mexpenses and registration fee for the award recipient to attend the 2009 Symposium.

The IEEE Symposium on VLSI Technology will be held in conjunction with the IEEE Symposium on VLSI Circuits, which is one of the top conferences in the field of integrated circuits. This Symopisum is also very demanding and competitive. Papers should be really breakthroughs to be accepted.

Well, despite the symposium is so demanding, it is worthy to work hard to make a suitable paper for this Symposium. And it is also a good opportunity to enjoy some days in Honolulu!


The 2008 IEEE RFIC (Radio Frequency Integrated Circuits) Symposium will be held in Atlanta, Georgia, on June 15-17 in conjunction with the IEEE MTT-S International Microwave Symposium (IMS), as part of the Microwave Week 2008.

The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.

The technical areas of RFIC 2008 include RFIC design, RFIC circuits, design methodology, system engineering, RF testing and packaging... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".

Certainly, RFIC'08, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.

The deadline for paper submission is January 3 2008.

IMS 2008

The IEEE MTT-S International Microwave Symposium 2008 (IMS 2008) will be held in Atlanta, Georgia from June 15 to June 20 2008.

IMS is the largest conference in the field of RF and microwave theory and techniques.

IMS'08 will include workshops, to be held on Sunday June 15, Monday June 16 and Friday June 20 2008. The IMS 2008 Technical Sessions will take place from Tuesday June 17 to Thursday June 18.

In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).

IMS will be part of the Microwave Week 2008, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.

The deadline for paper submission is December 7 2007.

Last but not least, IMS'08 includes a very interesting social programme, and a guest tour roster.
Certainly Atlanta is an exciting city that offers many places and activities to enjoy!

Friday, 5 October 2007


The 2008 EUROSOI Workshop will be held in Cork, Ireland, on January 23-25 2008.

The EUROSOI Workshop started as an event related to a former Coordination Action funded by the European Commission. EUROSOI was a Thematic Network which included most of the European teams working on SOI technology. Actually, this network will be funded again for three years more.

The EUROSOI Workshop has become an international forum to discuss the recent advances on all aspects of SOI technology: materials, devices, modeling, simulation and circuits.

EUROSOI 2008 will be organized by the Tyndall National Institute in Cork. The Chairman is Prof Jean-Pierre Colinge, a recognized pioneer in SOI technology.

The deadline for abstract submission is November 16 2007

Tuesday, 2 October 2007

European Microwave Week (EuMW) 2007

European Microwave Week provides the opportunity to attend four conferences and various workshops and short courses given by leading experts in their field. Moreover, the European Microwave Exhibition constitutes the largest trade show on RF and microwaves in Europe.

Following the pattern established in Paris in 2005, European Microwave Week now consists of four conferences:

The event focuses on the needs of engineers and researchers and seeks to serve both academia and industry. The week provides an opportunity for both communities to consider the latest trends and developments that are widening the field of application of microwaves.

European Microwave Week 2007 continues the series of successful microwave events and is set to return to Munich, Germany. By the, way, I cannot stand but recommending you to take this opportunity, and have a try with the Oktoberfest... It is actually worth it!

2008 IEEE International Reliability Physics Symposium

For over 40 years, IRPS has been the premier conference for engineers and scientists to present new and original work in the area of microelectronic device reliability. Originally started in the early 1960’s by the military and aerospace community, IRPS is now co-sponsored by the IEEE Reliability Society and the IEEE Electron Devices Society. This co-sponsored event has drawn participants from the United States, Europe, Asia and all other parts of the world. IRPS 2008 promotes the reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechanisms in the user’s environment, while demonstrating the latest state-of-the-art developments in electronic reliability.

The focus of the symposium is the 3-day plenary/parallel sessions (at the Phoenix Convention Center) featuring original work that identifies new microelectronic failure or degradation mechanisms, improves understanding of known failure mechanisms, demonstrates new or innovative analytical techniques, or demonstrates ways to build-in reliability. Specific areas to be addressed during the 2008 IRPS are reliability concerns associated with silicon (integrated circuits, discrete devices, MEMS), non-silicon (GaAs, LEDs and diode lasers, optical fiber and flat panel displays), and emerging technologies including organic electronics and nanotechnology:

  • Product Reliability and Burn-In
  • Non-Volatile Memory
  • Qualification Strategies
  • Circuits and Systems
  • Soft Error Effects
  • Assembly and Packaging
  • Failure Analysis
  • Transistors
  • High Power Devices
  • Devices and Processing
  • Interconnects
  • Device Dielectrics
  • ESD and Latch-Up
  • Process Induced Damage
  • MEMS
  • Nanoelectronics Device Reliability
  • Organic Electronics

Other opportunities at the symposium include:

  • A 2-day Tutorial Program featuring a set of bound notes from all tutorials. Attendees have the opportunity to learn a new area in some technical depth from an industry expert or brush up on the fundamentals with introductory tutorials. There are typically about 20 tutorials that are offered on topics ranging from back-end reliability to gate dielectric and transistor reliability to circuit/product reliability to assembly/ packaging reliability.
  • Reliability Year-In-Review Seminar. This seminar provides a summary of important work published from the previous year in key reliability areas. Industry experts serve as the “tour guide” and save you time by collecting and summarizing this information to bring you up to date in a particular area as efficiently as possible.
  • Evening Session Workshops enhance the synergy of the symposium by affording the attendees an opportunity to meet in informal groups to discuss key reliability physics topics with the guidance of experienced moderators. Some of the workshop topics are directly coupled to the tutorial program to allow more discussion on a particular topic.
  • Equipment Demonstrations held in parallel with tutorials and technical sessions are a unique aspect of this symposium. Manufacturers of state-of-the-art analytical and test and stress equipment are on hand to demonstrate their products and systems to individuals and small groups. Attendees are encouraged to bring samples or questions for onsite analysis and discussion.
  • An Evening Poster Session has become an important part of the IRPS for authors and attendees to discuss recent research and results in a very interactive environment.

    There are lots of opportunities to be involved in increasing your understanding of this technically important field. We look forward to seeing you in Phoenix!